Global Patent Index - EP 2333127 A4

EP 2333127 A4 20120704 - COPPER ALLOY MATERIAL FOR ELECTRICAL/ELECTRONIC COMPONENT

Title (en)

COPPER ALLOY MATERIAL FOR ELECTRICAL/ELECTRONIC COMPONENT

Title (de)

KUPFERLEGIERUNGSMATERIAL FÜR ELEKTRISCHE UND ELEKTRONISCHE BAUTEILE

Title (fr)

MATIÈRE D'ALLIAGE DE CUIVRE POUR UN COMPOSANT ÉLECTRIQUE/ÉLECTRONIQUE

Publication

EP 2333127 A4 20120704 (EN)

Application

EP 09804912 A 20090730

Priority

  • JP 2009063614 W 20090730
  • JP 2008202469 A 20080805

Abstract (en)

[origin: EP2333127A1] A copper alloy material for electrical/electronic components, which is characterized by containing 0.7-2.5% by mass of Co, while containing Si in such an amount that the mass ratio between Co and Si (Co/Si) is not less than 3.5 but not more than 4.0, with the balance made up of Cu and unavoidable impurities. The copper alloy material is also characterized by having a crystal grain size of 3-15 [mu]m.

IPC 8 full level

C22C 9/06 (2006.01); C22F 1/08 (2006.01); H01B 1/02 (2006.01)

CPC (source: EP)

C22C 9/06 (2013.01); C22F 1/08 (2013.01); H01B 1/026 (2013.01)

Citation (search report)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

DOCDB simple family (publication)

EP 2333127 A1 20110615; EP 2333127 A4 20120704; CN 102112641 A 20110629; CN 102112641 B 20130327; JP WO2010016428 A1 20120119; KR 20110039372 A 20110415; US 2011200480 A1 20110818; WO 2010016428 A1 20100211

DOCDB simple family (application)

EP 09804912 A 20090730; CN 200980130454 A 20090730; JP 2009063614 W 20090730; JP 2010523839 A 20090730; KR 20117004941 A 20090730; US 201113021444 A 20110204