EP 2336381 A1 20110622 - Plasma application of thermal barrier coatings with reduced thermal conductivity on combustor hardware
Title (en)
Plasma application of thermal barrier coatings with reduced thermal conductivity on combustor hardware
Title (de)
Plasmaanwendung von Wärmedämmbeschichtungen mit verringerter Wärmeleitfähigkeit auf der Brennkammer-Hardware
Title (fr)
Application de plasma sur des revêtements de barrière thermique à conductivité thermique réduite sur un matériel de chambre de combustion
Publication
Application
Priority
US 63805109 A 20091215
Abstract (en)
A process for forming a thermal barrier coating comprises the steps of providing a substrate, providing a gadolinia stabilized zirconia powder, and forming a thermal barrier coating having at least one of a porosity in a range of from 5 to 20% and a dense segmented structure on said substrate by supplying the gadolinia stabilized powder to a spray gun and using an air plasma spray technique.
IPC 8 full level
C23C 4/04 (2006.01); C23C 4/10 (2006.01); C23C 4/12 (2006.01)
CPC (source: EP US)
C23C 4/11 (2016.01 - EP US); C23C 4/134 (2016.01 - EP US)
Citation (applicant)
- US 5879753 A 19990309 - ZAJCHOWSKI PAUL H [US], et al
- US 99467697 A 19971219
Citation (search report)
- [XI] EP 1806436 A1 20070711 - UNITED TECHNOLOGIES CORP [US]
- [XI] EP 1642993 A1 20060405 - UNITED TECHNOLOGIES CORP [US]
- [A] EP 1889948 A2 20080220 - UNITED TECHNOLOGIES CORP [US]
- [A] EP 0992603 A1 20000412 - UNITED TECHNOLOGIES CORP [US]
- [A] EP 1621647 A2 20060201 - UNITED TECHNOLOGIES CORP [US]
- [A] EP 1550744 A1 20050706 - GEN ELECTRIC [US]
- [A] EP 1889940 A2 20080220 - UNITED TECHNOLOGIES CORP [US]
- [A] EP 1674663 A2 20060628 - MITSUBISHI HEAVY IND LTD [JP], et al
- [A] US 2003152814 A1 20030814 - GUPTA DINESH [US], et al
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
Designated extension state (EPC)
BA ME RS
DOCDB simple family (publication)
EP 2336381 A1 20110622; EP 2336381 B1 20140604; SG 172522 A1 20110728; US 2011143043 A1 20110616
DOCDB simple family (application)
EP 10251689 A 20100930; SG 2010067361 A 20100916; US 63805109 A 20091215