Global Patent Index - EP 2337044 A1

EP 2337044 A1 20110622 - Methods for manufacturing a stud of an electric contact and an electric contact

Title (en)

Methods for manufacturing a stud of an electric contact and an electric contact

Title (de)

Herstellungsverfahren eines Kontaktplättchens eines elektrischen Kontakts und eines elektrischen Kontakts

Title (fr)

Procédés de fabrication d'un plot de contact électrique et d'un contact électrique

Publication

EP 2337044 A1 20110622 (FR)

Application

EP 09179852 A 20091218

Priority

EP 09179852 A 20091218

Abstract (en)

The method of producing an electrical contact pad comprising a support pad and a contact layer, comprises depositing a first powder (1) on the support pad to form the contact layer by cold gas dynamic spraying. The first powder containing particles comprises grains (10-40 vol.%) of a refractory material embedded in a matrix based on the conductive metal including silver or copper, pure metal particles corresponding to the conductive metal matrix, and particles comprising grains of a doping agent embedded in a metal matrix, which corresponds to the metal conductive metal matrix. The method of producing an electrical contact pad comprising a support pad and a contact layer, comprises depositing a first powder (1) on the support pad to form the contact layer by cold gas dynamic spraying. The first powder containing particles comprises grains (10-40 vol.%) of a refractory material embedded in a matrix based on the conductive metal including silver or copper, pure metal particles corresponding to the conductive metal matrix, and particles comprising grains of a doping agent embedded in a metal matrix, which corresponds to the metal conductive metal matrix. The doping agent is embedded with grains of refractory material in their matrix of conductive metal. The particles comprising grains of refractory material are obtained by the process including physical vapor deposition, chemical vapor deposition and electroless process, and by chemical precipitation on particles in suspension. The contact support is present in the form of precut individual pieces. Independent claims are included for: (1) a method for producing an electrical contact comprising a contact support and a pad; (2) an electrical contact; and (3) an electrical contact pad.

Abstract (fr)

La présente invention concerne un procédé de fabrication d'un plot de contact électrique comprenant un support de plot et au moins une couche de contact, ainsi qu'un procédé de fabrication d'un contact électrique comprenant un support de contact et au moins une couche de contact. Lesdits procédés comprennent une étape de dépôt, par projection dynamique par gaz froid, d'une première poudre sur ledit support de plot ou de contact pour former ladite couche de contact, ladite première poudre contenant au moins des particules comprenant des grains d'au moins un matériau réfractaire incorporés dans une matrice à base de métal conducteur choisi parmi l'argent ou le cuivre. L'invention concerne également les plots et les contacts électriques obtenus par lesdits procédés de fabrication respectifs.

IPC 8 full level

H01H 1/021 (2006.01); C23C 24/04 (2006.01)

CPC (source: EP US)

C23C 24/04 (2013.01 - EP US); C23C 28/021 (2013.01 - EP US); C23C 28/023 (2013.01 - EP US); C23C 28/027 (2013.01 - EP US); H01H 1/021 (2013.01 - EP US); H01H 11/048 (2013.01 - EP US); H01H 1/023 (2013.01 - EP US); H01H 1/025 (2013.01 - EP US); Y10T 29/49208 (2015.01 - EP US)

Citation (applicant)

Citation (search report)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

Designated extension state (EPC)

AL BA RS

DOCDB simple family (publication)

EP 2337044 A1 20110622; BR 112012014648 A2 20170314; CA 2788260 A1 20110623; CN 102763183 A 20121031; CN 102763183 B 20150311; EP 2513932 A1 20121024; EP 2513932 B1 20131127; JP 2013514614 A 20130425; MX 2012007066 A 20121003; MX 337345 B 20140822; US 2012305300 A1 20121206; WO 2011073314 A1 20110623

DOCDB simple family (application)

EP 09179852 A 20091218; BR 112012014648 A 20101216; CA 2788260 A 20101216; CN 201080064059 A 20101216; EP 10793241 A 20101216; EP 2010069885 W 20101216; JP 2012543748 A 20101216; MX 2012007066 A 20101216; US 201013516807 A 20101216