Global Patent Index - EP 2338169 A4

EP 2338169 A4 20140312 - PACKAGE WITH POWER AND GROUND THROUGH VIA

Title (en)

PACKAGE WITH POWER AND GROUND THROUGH VIA

Title (de)

GEHÄUSE MIT STROM- UND ERDUNGSDURCHGANG

Title (fr)

BOÎTIER AVEC TROU D INTERCONNEXION D ALIMENTATION ET DE MISE À LA MASSE

Publication

EP 2338169 A4 20140312 (EN)

Application

EP 09813382 A 20090107

Priority

  • US 2009030303 W 20090107
  • US 20678608 A 20080909

Abstract (en)

[origin: US2010059865A1] A wire bond design integrated circuit with a substrate having a front side and an opposing back side. Circuitry is disposed on the font side. Electrically conductive vias are disposed through the substrate from the front side to the back side, and are electrically connected to the circuitry such that the electrically conductive vias provide power and ground services only for the circuitry. Bonding pads are disposed on the front side, and are electrically connected to the circuitry such that the bonding pads provide signal communication only for the circuitry.

IPC 8 full level

H01L 23/528 (2006.01); H01L 23/498 (2006.01); H01L 23/50 (2006.01)

CPC (source: EP KR US)

H01L 23/3128 (2013.01 - EP US); H01L 23/48 (2013.01 - KR); H01L 23/481 (2013.01 - EP US); H01L 23/49816 (2013.01 - EP US); H01L 23/49838 (2013.01 - EP US); H01L 24/32 (2013.01 - EP US); H01L 24/73 (2013.01 - EP US); H01L 24/29 (2013.01 - EP US); H01L 24/48 (2013.01 - EP US); H01L 2224/13099 (2013.01 - EP US); H01L 2224/2929 (2013.01 - EP US); H01L 2224/32225 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48227 (2013.01 - EP US); H01L 2224/484 (2013.01 - EP US); H01L 2224/73257 (2013.01 - EP US); H01L 2224/73265 (2013.01 - EP US); H01L 2224/83194 (2013.01 - EP US); H01L 2224/92125 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/00015 (2013.01 - EP US); H01L 2924/01014 (2013.01 - EP US); H01L 2924/01023 (2013.01 - EP US); H01L 2924/01031 (2013.01 - EP US); H01L 2924/01032 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01057 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/07811 (2013.01 - EP US); H01L 2924/10252 (2013.01 - EP US); H01L 2924/10253 (2013.01 - EP US); H01L 2924/10329 (2013.01 - EP US); H01L 2924/12041 (2013.01 - EP US); H01L 2924/14 (2013.01 - EP US); H01L 2924/15311 (2013.01 - EP US); H01L 2924/15312 (2013.01 - EP US); H01L 2924/181 (2013.01 - EP US)

C-Set (source: EP US)

  1. H01L 2224/484 + H01L 2924/00014
  2. H01L 2924/14 + H01L 2924/00
  3. H01L 2924/181 + H01L 2924/00012
  4. H01L 2224/48091 + H01L 2924/00014
  5. H01L 2924/00015 + H01L 2224/48233
  6. H01L 2924/00014 + H01L 2224/45099
  7. H01L 2224/2929 + H01L 2924/0665 + H01L 2924/00014
  8. H01L 2924/07811 + H01L 2924/0665 + H01L 2924/00014
  9. H01L 2224/73265 + H01L 2224/32225 + H01L 2224/48227 + H01L 2924/00
  10. H01L 2924/15311 + H01L 2224/73265 + H01L 2224/32225 + H01L 2224/48227 + H01L 2924/00
  11. H01L 2924/12041 + H01L 2924/00

Citation (search report)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR

DOCDB simple family (publication)

US 2010059865 A1 20100311; US 8350379 B2 20130108; CN 102057481 A 20110511; CN 102057481 B 20150408; EP 2338169 A1 20110629; EP 2338169 A4 20140312; JP 2012502470 A 20120126; JP 2013085007 A 20130509; JP 5350550 B2 20131127; JP 5525530 B2 20140618; KR 101333387 B1 20131128; KR 20110053233 A 20110519; TW 201011875 A 20100316; TW I453875 B 20140921; WO 2010030398 A1 20100318

DOCDB simple family (application)

US 20678608 A 20080909; CN 200980122475 A 20090107; EP 09813382 A 20090107; JP 2011526065 A 20090107; JP 2013027597 A 20130215; KR 20117005408 A 20090107; TW 98102349 A 20090121; US 2009030303 W 20090107