EP 2338594 A1 20110629 - Thermal plate
Title (en)
Thermal plate
Title (de)
Wärmeplatte
Title (fr)
Plaque thermique
Publication
Application
Priority
EP 09180560 A 20091223
Abstract (en)
The present invention relates to a thermal plate for heating and/or cooling several caps comprising a base plate of thermally conducting material; several receptacles for caps being in thermal contact with the base plate; a support structure for supporting the receptacles being in thermal contact with the base plate; and means for heating and/or cooling the base plate, wherein the support structure together with the base plate provides a substantially closed hollow space surrounding the receptacles.
IPC 8 full level
CPC (source: EP)
B01L 3/50851 (2013.01); B01L 7/52 (2013.01); B01L 2200/12 (2013.01); B01L 2200/147 (2013.01); B01L 2300/0654 (2013.01); B01L 2300/0829 (2013.01); B01L 2300/1838 (2013.01); B01L 2300/1894 (2013.01)
Citation (applicant)
WO 2008002991 A2 20080103 - BIO RAD LABORATORIES [US], et al
Citation (search report)
- [X] US 5410130 A 19950425 - BRAUNSTEIN ZACHARY L [US]
- [X] WO 8909437 A1 19891005 - DEAN PETER DUNCAN GOODEARL [GB], et al
- [X] US 5710381 A 19980120 - ATWOOD JOHN GIRDNER [US], et al
- [A] GB 2446303 A 20080806 - ADVANCED BIOTECH LTD [GB]
- [A] WO 9843740 A2 19981008 - PERKIN ELMER CORP [US], et al
- [A] US 2001051112 A1 20011213 - GULZOW NICO [DE], et al
- [A] WO 2008035074 A2 20080327 - BG RES LTD [GB], et al
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
Designated extension state (EPC)
AL BA RS
DOCDB simple family (publication)
DOCDB simple family (application)
EP 09180560 A 20091223