EP 2340695 A1 20110706 - HOUSING AND METHOD FOR ASSEMBLING THE HOUSING
Title (en)
HOUSING AND METHOD FOR ASSEMBLING THE HOUSING
Title (de)
GEHÄUSE UND VERFAHREN ZUR MONTAGE DES GEHÄUSES
Title (fr)
BOÎTIER ET PROCÉDÉ DE MONTAGE DU BOÎTIER
Publication
Application
Priority
EP 2008064583 W 20081028
Abstract (en)
[origin: WO2010048986A1] The invention relates to a housing for receiving a circuit board, comprising a first housing part having a first floor and a first side wall; comprising a second housing part having a second floor and a second side wall; wherein the first housing part comprises at least one catch protrusion in an area of at least one corner, said protrusion protruding past the first side wall; wherein the second housing part comprises a catch recess in the area of at least one corner. The invention further relates to a method for assembling the housing and to an assembly device.
IPC 8 full level
H05K 5/00 (2006.01)
CPC (source: EP KR US)
H05K 5/00 (2013.01 - KR); H05K 5/0013 (2013.01 - EP US); H05K 5/06 (2013.01 - KR); Y10T 29/49826 (2015.01 - EP US)
Citation (search report)
See references of WO 2010048986A1
Citation (examination)
JP H08162770 A 19960621 - YAZAKI CORP
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA MK RS
DOCDB simple family (publication)
WO 2010048986 A1 20100506; CN 102204422 A 20110928; EP 2340695 A1 20110706; JP 2012507159 A 20120322; JP 5762296 B2 20150812; KR 20110091701 A 20110812; US 2011203966 A1 20110825
DOCDB simple family (application)
EP 2008064583 W 20081028; CN 200880131727 A 20081028; EP 08875238 A 20081028; JP 2011533544 A 20081028; KR 20117012190 A 20081028; US 200813126763 A 20081028