Global Patent Index - EP 2341885 A2

EP 2341885 A2 20110713 - ORTHODONTIC COMPOSITION WITH HEAT MODIFIED MINERALS

Title (en)

ORTHODONTIC COMPOSITION WITH HEAT MODIFIED MINERALS

Title (de)

KIEFERORTHOPÄDISCHE ZUSAMMENSETZUNG MIT WÄRMEMODIFIZIERTEN MINERALIEN

Title (fr)

COMPOSITION ORTHODONTIQUE CONTENANT DES MINÉRAUX MODIFIÉS PAR LA CHALEUR

Publication

EP 2341885 A2 20110713 (EN)

Application

EP 09792302 A 20090908

Priority

  • US 2009056180 W 20090908
  • US 10133908 P 20080930

Abstract (en)

[origin: WO2010039395A2] The invention provides an orthodontic composition, related methods and packaged articles that include a hardenable component, a hardener, and a heat-modified inorganic mineral filler. The composition displays improved hardened remnant cleanup compared with compositions using traditional hard mineral fillers, while maintaining acceptable handling, bond strength and mechanical properties. Bond strength enhancement is achieved by heat-modifying a soft mineral filler, a process by which water of hydration is eliminated from the microstructure of the mineral to form a non-hydrated phase. By using heat-modified mineral fillers that are soft relative to human enamel, the hardened orthodontic composition can be conveniently removed using a low-speed abrasive disk or other mild abrasion process that is safer and more comfortable for the patient. The composition is especially beneficial for use in bonding orthodontic appliances to teeth.

IPC 8 full level

A61K 6/02 (2006.01)

CPC (source: EP US)

A61K 6/30 (2020.01 - EP US)

Citation (search report)

See references of WO 2010039395A2

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

Designated extension state (EPC)

AL BA RS

DOCDB simple family (publication)

WO 2010039395 A2 20100408; WO 2010039395 A3 20100819; EP 2341885 A2 20110713; JP 2012504125 A 20120216; US 2011171591 A1 20110714

DOCDB simple family (application)

US 2009056180 W 20090908; EP 09792302 A 20090908; JP 2011529074 A 20090908; US 200913120956 A 20090908