EP 2342739 A4 20130522 - MANAGING THERMAL BUDGET IN ANNEALING OF SUBSTRATES
Title (en)
MANAGING THERMAL BUDGET IN ANNEALING OF SUBSTRATES
Title (de)
VERWALTUNG DES WÄRMEBUDGETS BEIM GLÜHEN VON SUBSTRATEN
Title (fr)
GESTION DU BUDGET THERMIQUE DANS LE RECUIT DE SUBSTRATS
Publication
Application
Priority
- US 2009055838 W 20090903
- US 21215708 A 20080917
- US 21221408 A 20080917
Abstract (en)
[origin: WO2010033389A1] A method and apparatus are provided for treating a substrate. The substrate is positioned on a support in a thermal treatment chamber. Electromagnetic radiation is directed toward the substrate to anneal a portion of the substrate. Other electromagnetic radiation is directed toward the substrate to preheat a portion of the substrate. The preheating reduces thermal stresses at the boundary between the preheat region and the anneal region. Any number of anneal and preheat regions are contemplated, with varying shapes and temperature profiles, as needed for specific embodiments. Any convenient source of electromagnetic radiation may be used, such as lasers, heat lamps, white light lamps, or flash lamps.
IPC 8 full level
H01L 21/324 (2006.01); H01L 21/67 (2006.01)
CPC (source: EP KR)
H01L 21/324 (2013.01 - EP KR); H01L 21/67115 (2013.01 - EP)
Citation (search report)
- [X] EP 0091806 A2 19831019 - FUJITSU LTD [JP]
- [X] US 2008045040 A1 20080221 - NAKAO TAKASHI [JP]
- [X] JP S58106836 A 19830625 - HITACHI LTD
- [X] US 6187616 B1 20010213 - GYODA KOZO [JP]
- See references of WO 2010033389A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
DOCDB simple family (publication)
WO 2010033389 A1 20100325; CN 102160157 A 20110817; CN 102160157 B 20151125; EP 2342739 A1 20110713; EP 2342739 A4 20130522; JP 2012503311 A 20120202; JP 5611212 B2 20141022; KR 101800404 B1 20171122; KR 101868378 B1 20180618; KR 20110053387 A 20110520; KR 20170130616 A 20171128; SG 10201807844V A 20181030; SG 193882 A1 20131030; TW 201013789 A 20100401; TW 201342480 A 20131016; TW 201415558 A 20140416; TW I419234 B 20131211; TW I549190 B 20160911; TW I549191 B 20160911
DOCDB simple family (application)
US 2009055838 W 20090903; CN 200980136613 A 20090903; EP 09814993 A 20090903; JP 2011526919 A 20090903; KR 20117008790 A 20090903; KR 20177033214 A 20090903; SG 10201807844V A 20090903; SG 2013069232 A 20090903; TW 102122198 A 20090909; TW 102141287 A 20090909; TW 98130387 A 20090909