EP 2342959 A1 20110713 - METHOD FOR INTEGRATING AN ELECTRONIC COMPONENT INTO A PRINTED CIRCUIT BOARD
Title (en)
METHOD FOR INTEGRATING AN ELECTRONIC COMPONENT INTO A PRINTED CIRCUIT BOARD
Title (de)
VERFAHREN ZUR INTEGRATION EINES ELEKTRONISCHEN BAUTEILS IN EINE LEITERPLATTE
Title (fr)
PROCÉDÉ D'INTÉGRATION D'UN COMPOSANT ÉLECTRONIQUE DANS UNE CARTE IMPRIMÉE
Publication
Application
Priority
- AT 2009000419 W 20091028
- AT 6192008 U 20081030
Abstract (en)
[origin: WO2010048654A1] The invention relates to a method for integrating an electronic component into a printed circuit board, said method comprising the following steps: a layer of a printed circuit board is used to support the electronic component (4); holes (3) corresponding to the contacts (6) of the electronic component (4) are formed in the layer (1); an adhesive (5) is applied to the layer (1) supporting the electronic component (4); the electronic component (4) is fixed to the layer (1) with the contacts (6) oriented towards the layer (1) and the holes (3); adhesive (5) possibly in the region of the holes or perforations (3) is removed, especially by the application of a laser beam (9); and an electroconductive layer (10) is formed for contacting the contacts (6) of the electronic component (4) on the surface of the layer (1), facing away from the component (4). According to said method, in order to remove the adhesive (5) from the holes or perforations (3), a laser beam (9) with dimensions or a diameter measuring more than the internal width of the holes or perforations is used, enabling a simple, rapid and reliable removal of adhesive (5) from the holes (3) corresponding to the contacts (6) of the component (4) to be integrated.
IPC 8 full level
H05K 1/18 (2006.01); B23K 26/38 (2006.01); H01L 21/56 (2006.01); H01L 21/60 (2006.01); H05K 3/00 (2006.01); H05K 3/02 (2006.01)
CPC (source: EP US)
H01L 21/568 (2013.01 - EP US); H01L 23/5389 (2013.01 - EP US); H01L 24/19 (2013.01 - EP US); H01L 24/29 (2013.01 - EP US); H01L 24/82 (2013.01 - EP US); H01L 24/83 (2013.01 - EP US); H05K 1/185 (2013.01 - EP US); H05K 1/188 (2013.01 - EP US); B23K 2101/42 (2018.07 - EP US); B23K 2103/30 (2018.07 - EP US); B23K 2103/50 (2018.07 - EP US); H01L 2224/04105 (2013.01 - EP US); H01L 2224/16 (2013.01 - EP US); H01L 2224/2929 (2013.01 - EP US); H01L 2224/29299 (2013.01 - EP US); H01L 2224/82001 (2013.01 - EP US); H01L 2224/82039 (2013.01 - EP US); H01L 2224/83192 (2013.01 - EP US); H01L 2224/8385 (2013.01 - EP US); H01L 2224/92144 (2013.01 - EP US); H01L 2924/00013 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01074 (2013.01 - EP US); H01L 2924/01078 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/07802 (2013.01 - EP US); H01L 2924/0781 (2013.01 - EP US); H05K 3/0035 (2013.01 - EP US); H05K 3/02 (2013.01 - EP US); H05K 3/305 (2013.01 - EP US); H05K 3/32 (2013.01 - EP US); H05K 2201/0355 (2013.01 - EP US); H05K 2201/10674 (2013.01 - EP US); H05K 2201/10977 (2013.01 - EP US); H05K 2203/0554 (2013.01 - EP US); H05K 2203/1469 (2013.01 - EP US); Y10T 156/1056 (2015.01 - EP US)
Citation (search report)
See references of WO 2010048654A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
Designated extension state (EPC)
AL BA RS
DOCDB simple family (publication)
WO 2010048654 A1 20100506; AT 12316 U1 20120315; EP 2342959 A1 20110713; US 2011198018 A1 20110818
DOCDB simple family (application)
AT 2009000419 W 20091028; AT 6192008 U 20081030; EP 09756396 A 20091028; US 200913125858 A 20091028