EP 2344690 A4 20130501 - PROCESS FOR MOLDING A FRICTION WAFER
Title (en)
PROCESS FOR MOLDING A FRICTION WAFER
Title (de)
VERFAHREN ZUM FORMEN EINER FRIKTIONSSCHEIBE
Title (fr)
PROCESSUS DE MOULAGE D UNE TRANCHE À FRICTION
Publication
Application
Priority
US 2008011571 W 20081008
Abstract (en)
[origin: WO2010042087A1] A process and apparatus for making die-dried friction wafers collects friction particulates in a mold defining a wafer. The mold includes at least one perforate wall portion against which an aqueous slurry including the particulates is passed to form at least one layer on the wall as the particulates collect in the mold. The collection is dried followed by curing, and may be cured in the mold by heating.
IPC 8 full level
D02G 3/00 (2006.01); F16D 69/02 (2006.01)
CPC (source: EP)
F16D 69/026 (2013.01)
Citation (search report)
- No further relevant documents disclosed
- See references of WO 2010042087A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2010042087 A1 20100415; EP 2344690 A1 20110720; EP 2344690 A4 20130501
DOCDB simple family (application)
US 2008011571 W 20081008; EP 08816678 A 20081008