Global Patent Index - EP 2345314 A1

EP 2345314 A1 20110720 - FLEXIBLE PRINTED CIRCUIT BOARD

Title (en)

FLEXIBLE PRINTED CIRCUIT BOARD

Title (de)

FLEXIBLE LEITERPLATTE

Title (fr)

CARTE DE CIRCUIT IMPRIMÉ FLEXIBLE

Publication

EP 2345314 A1 20110720 (DE)

Application

EP 09744937 A 20091009

Priority

  • DE 2009001409 W 20091009
  • DE 102008052244 A 20081018

Abstract (en)

[origin: WO2010043203A1] The invention relates to a flexible printed circuit board, particularly for connecting electronic components over a space, comprising a carrier film (1), a plurality of bonding surfaces (10) disposed on the carrier film (1), a plurality of soldering surfaces (2) which are disposed on the carrier film (1) and connected to the bonding surfaces (10) by way of electrical tracks, and a reinforcing plate (3) which is non-detachably connected to the carrier film (1), wherein the soldering surfaces (2) and the reinforcing plate (3) are disposed on a soldering side (4) of the carrier film (1) and the bonding surfaces (10) are disposed on a bonding side (12) disposed opposite of the soldering side (4).

IPC 8 full level

H05K 1/11 (2006.01)

CPC (source: EP US)

H05K 1/118 (2013.01 - EP US); H05K 3/0058 (2013.01 - EP US); H05K 3/281 (2013.01 - EP US); H05K 2201/0394 (2013.01 - EP US); H05K 2201/2009 (2013.01 - EP US); H05K 2203/049 (2013.01 - EP US); Y10T 428/24777 (2015.01 - EP US); Y10T 428/24917 (2015.01 - EP US); Y10T 428/31515 (2015.04 - EP US)

Citation (search report)

See references of WO 2010043203A1

Citation (examination)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

Designated extension state (EPC)

AL BA RS

DOCDB simple family (publication)

DE 102008052244 A1 20100422; DE 112009002460 A5 20110714; DE 112009002460 B4 20220120; EP 2345314 A1 20110720; JP 2012506161 A 20120308; JP 5489013 B2 20140514; US 2011232946 A1 20110929; US 8853547 B2 20141007; WO 2010043203 A1 20100422

DOCDB simple family (application)

DE 102008052244 A 20081018; DE 112009002460 T 20091009; DE 2009001409 W 20091009; EP 09744937 A 20091009; JP 2011533529 A 20091009; US 200913124699 A 20091009