EP 2348804 B1 20130619 - Assembly with at least one semiconductor module and a transport package
Title (en)
Assembly with at least one semiconductor module and a transport package
Title (de)
Anordnung mit mindestens einem Leistungshalbleitermodul und mit einer Transportverpackung
Title (fr)
Agencement doté d'au moins un module semi-conducteur de puissance et d'un emballage de transport
Publication
Application
Priority
DE 102010005048 A 20100120
Abstract (en)
[origin: EP2348804A1] The arrangement (1,1') has a transport packaging (2) which comprises a cover layer (10), an intermediate layer (20) with a recess (230), and a cover foil. The cover layer is formed with a main surface (100) in laminar manner, where the main surface faces a power semiconductor module (5). The cover foil covers a portion of the power semiconductor module. The cover foil is connected with a main surface (200) of the intermediate layer.
IPC 8 full level
H05K 13/00 (2006.01); B65D 75/32 (2006.01); B65D 75/36 (2006.01)
CPC (source: EP KR US)
B65D 75/327 (2013.01 - EP KR US); B65D 75/367 (2013.01 - EP KR US); B65D 81/02 (2013.01 - KR); B65D 85/30 (2013.01 - KR); B65D 2575/3245 (2013.01 - EP KR US); B65D 2585/86 (2013.01 - KR)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 2348804 A1 20110727; EP 2348804 B1 20130619; CN 102145795 A 20110810; CN 102145795 B 20150819; DE 102010005048 A1 20110721; JP 2011148555 A 20110804; JP 5732260 B2 20150610; KR 101784518 B1 20171011; KR 20110085870 A 20110727; US 2011203967 A1 20110825; US 8405195 B2 20130326
DOCDB simple family (application)
EP 10192495 A 20101125; CN 201110025019 A 20110120; DE 102010005048 A 20100120; JP 2011005745 A 20110114; KR 20100137809 A 20101229; US 201113010637 A 20110120