EP 2349783 A1 20110803 - LIGHT-EMITTING DIODE MODULE FOR A VEHICLE, AND DIODE MOUNTING
Title (en)
LIGHT-EMITTING DIODE MODULE FOR A VEHICLE, AND DIODE MOUNTING
Title (de)
LEUCHTDIODENMODUL FÜR EIN FAHRZEUG UND DIODENBEFESTIGUNG
Title (fr)
MODULE A DIODES ELECTROLUMINESCENTES POUR VEHICULE, SUPPORT A DIODES
Publication
Application
Priority
- FR 2009052065 W 20091027
- FR 0857299 A 20081027
Abstract (en)
[origin: WO2010049639A1] The present invention relates to a diode module for a vehicle (100), comprising a first curved transparent sheet (1), and diodes (2), each of which comprises an emitter chip (2) capable of emitting one or more radiations in the visible range and guided into the first sheet after injection by the side section or by the side surface with openings in one of the main surfaces of the sheet and housing the diodes, and comprising a profile section (3) for supporting the diodes on the edge of the glazing comprising a clip (30) for attachment to the glazing with a so-called median part, a first discontinuous flange (31) having a first series of tabs for attaching and/or centring the clip (31) and separated from one another, and a second discontinuous flange (32) with a second series of tabs for attaching the clip (32) and separated from one another, the first and/or second series of tabs thus forming means for holding the diodes (2) in predetermined vertical positions relative to the first sheet.
IPC 8 full level
B60Q 3/02 (2006.01); G02B 6/00 (2006.01); F21W 107/10 (2018.01)
CPC (source: EP KR US)
B32B 17/10018 (2013.01 - EP US); B32B 17/10036 (2013.01 - EP US); B32B 17/10293 (2013.01 - EP US); B32B 17/10541 (2013.01 - EP US); B32B 17/10761 (2013.01 - EP US); B32B 17/1077 (2013.01 - EP US); B32B 17/10788 (2013.01 - EP US); B60Q 3/208 (2017.01 - EP US); G02B 6/00 (2013.01 - KR); G02B 6/002 (2013.01 - EP US); G02B 6/0068 (2013.01 - EP US); G02B 6/0091 (2013.01 - EP US); B32B 2369/00 (2013.01 - EP US); G02B 6/0021 (2013.01 - EP US)
Citation (search report)
See references of WO 2010049639A1
Citation (examination)
EP 1655536 A1 20060510 - OMRON TATEISI ELECTRONICS CO [JP]
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
DOCDB simple family (publication)
FR 2937711 A1 20100430; FR 2937711 B1 20101119; BR PI0920060 A2 20160405; CN 102245432 A 20111116; EA 201170612 A1 20111230; EP 2349783 A1 20110803; JP 2012506811 A 20120322; KR 20110081308 A 20110713; MX 2011004386 A 20110728; US 2011273874 A1 20111110; WO 2010049639 A1 20100506
DOCDB simple family (application)
FR 0857299 A 20081027; BR PI0920060 A 20091027; CN 200980150084 A 20091027; EA 201170612 A 20091027; EP 09760222 A 20091027; FR 2009052065 W 20091027; JP 2011532700 A 20091027; KR 20117011972 A 20091027; MX 2011004386 A 20091027; US 200913125879 A 20091027