EP 2350357 B1 20190821 - A SUBSTRATE HOLDER FOR HOLDING A CONDUCTIVE SUBSTRATE DURING PLATING THEREOF
Title (en)
A SUBSTRATE HOLDER FOR HOLDING A CONDUCTIVE SUBSTRATE DURING PLATING THEREOF
Title (de)
SUBSTRATHALTER ZUM HALTEN EINES LEITFÄHIGEN SUBSTRATS WÄHREND DES GALVANISIERENS
Title (fr)
PORTE-SUBSTRAT POUR MAINTENIR UN SUBSTRAT CONDUCTEUR PENDANT LE PLACAGE DE CELUI-CI
Publication
Application
Priority
EP 2008009658 W 20081114
Abstract (en)
[origin: WO2010054677A1] A system for plating a conductive substrate is provided. The system comprises a conductive substrate, comprising a first and a second conductive side, wherein said first side of the conductive substrate is to be plated. Furthermore, the system comprises a substrate holder with an attachment means, for attaching the conductive substrate to the substrate holder, such that a first surface of the substrate holder faces the second side of the conductive substrate. The substrate holder also comprises a resilient contact means, attached to the first surface of the substrate holder, said resilient contact means being connectable to a first external potential. The second side of the conductive substrate is provided with an insulating material exposing the second side of the conductive substrate, such that at least one contact area is provided, wherein the resilient contact means is in contact with the exposed second side in said at least one contact area. A substrate holder therefore is also provided.
IPC 8 full level
C25D 17/00 (2006.01); C25D 17/06 (2006.01)
CPC (source: EP KR US)
C25D 17/00 (2013.01 - KR); C25D 17/005 (2013.01 - EP US); C25D 17/06 (2013.01 - EP KR US); C25D 17/001 (2013.01 - EP US); C25D 17/002 (2013.01 - EP US)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2010054677 A1 20100520; CN 102257186 A 20111123; CN 102257186 B 20141015; DK 2350357 T3 20191125; EP 2350357 A1 20110803; EP 2350357 B1 20190821; JP 2012508814 A 20120412; JP 5469178 B2 20140409; KR 20110088571 A 20110803; TW 201020344 A 20100601; TW I468552 B 20150111; US 2011278162 A1 20111117
DOCDB simple family (application)
EP 2008009658 W 20081114; CN 200880132397 A 20081114; DK 08875022 T 20081114; EP 08875022 A 20081114; JP 2011535881 A 20081114; KR 20117013599 A 20081114; TW 98131796 A 20090921; US 200813129330 A 20081114