EP 2356267 A1 20110817 - ELECTRODEPOSITION BATHS, SYSTEMS AND METHODS
Title (en)
ELECTRODEPOSITION BATHS, SYSTEMS AND METHODS
Title (de)
BÄDER, SYSTEME UND VERFAHREN ZUR ELEKTROTAUCHLACKIERUNG
Title (fr)
BAINS, SYSTÈMES ET PROCÉDÉS DE DÉPÔT ÉLECTROLYTIQUE
Publication
Application
Priority
- US 2009005967 W 20091104
- US 26697908 A 20081107
- US 26701008 A 20081107
Abstract (en)
[origin: WO2010053540A1] Electrodeposition baths, systems and methods are provided. In some embodiments, the baths, systems and methods are used to deposit metal alloy coatings.
IPC 8 full level
C25D 3/56 (2006.01); B22F 7/00 (2006.01); B22F 7/04 (2006.01); C25D 5/18 (2006.01); C25D 21/12 (2006.01); C25D 3/66 (2006.01); G01N 27/42 (2006.01)
CPC (source: EP KR US)
B22F 7/04 (2013.01 - EP); C25D 3/12 (2013.01 - KR); C25D 3/56 (2013.01 - EP KR US); C25D 3/562 (2013.01 - EP); C25D 5/18 (2013.01 - EP KR US); C25D 5/611 (2020.08 - EP KR US); C25D 5/617 (2020.08 - EP KR US); C25D 5/619 (2020.08 - EP KR US); C25D 5/627 (2020.08 - EP KR US); C25D 21/12 (2013.01 - EP); B22F 2998/00 (2013.01 - EP); C25D 3/66 (2013.01 - EP); G01N 27/42 (2013.01 - EP)
C-Set (source: EP)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
DOCDB simple family (publication)
WO 2010053540 A1 20100514; CA 2742934 A1 20100514; CN 102272356 A 20111207; EP 2356267 A1 20110817; EP 2356267 A4 20160330; JP 2012508322 A 20120405; JP 2015165053 A 20150917; KR 20110083707 A 20110720
DOCDB simple family (application)
US 2009005967 W 20091104; CA 2742934 A 20091104; CN 200980153812 A 20091104; EP 09825108 A 20091104; JP 2011535556 A 20091104; JP 2015098516 A 20150513; KR 20117012744 A 20091104