EP 2358497 A1 20110824 - MOULD FOR SOLDERING, ARRANGEMENT OF MOULDS, A METHOD AND A COMPONENT
Title (en)
MOULD FOR SOLDERING, ARRANGEMENT OF MOULDS, A METHOD AND A COMPONENT
Title (de)
FORMKÖRPER ZUM LÖTEN, ANORDNUNG VON FORMKÖRPERN, EIN VERFAHREN SOWIE EIN BAUTEIL
Title (fr)
CORPS MOULÉS UTILISÉS DANS LES OPÉRATIONS DE BRASAGE, ENSEMBLE DE CORPS MOULÉS, PROCÉDÉ ET ÉLÉMENT APPROPRIÉS
Publication
Application
Priority
- EP 2009065450 W 20091119
- EP 08021762 A 20081215
- EP 09756484 A 20091119
Abstract (en)
[origin: EP2196276A1] The flat molding body (4) comprises continuous passages formed from an upper side to a lower side of the molding body by perforations or bores and formed by an open porosity in a sponge-like manner. The molding body is formed as double-T-piece, puzzle piece and presintered flat material. The T-beam (13) of the double-T-piece has an additional hooking (16). The molding body consists of metal or metal alloy. The puzzle piece is removable as convexly and/or concavely limited flat polygon body with a contiguous flat coating and leaves gaps between individual polygon bodies. The flat molding body (4) comprises continuous passages formed from an upper side to a lower side of the molding body by perforations or bores and formed by an open porosity in a sponge-like manner. The molding body is formed as double-T-piece, puzzle piece and presintered flat material. The T-beam (13) of the double-T-piece has an additional hooking (16). The molding body consists of metal or metal alloy. The puzzle piece is removable as convexly and/or concavely limited flat polygon body with a contiguous flat coating and leaves gaps between individual polygon bodies. The convex and concave portions of the individual puzzle pieces allow a positive hooking of the individual puzzle pieces to the contiguous flat coating. Independent claims are included for: (1) an arrangement of several molding bodies; (2) a method for soldering a component; and (3) a component.
IPC 8 full level
B23K 1/00 (2006.01); B23K 35/02 (2006.01); F01D 5/00 (2006.01)
CPC (source: EP US)
B23K 1/0018 (2013.01 - EP US); B23K 3/08 (2013.01 - EP US); B23K 26/03 (2013.01 - EP US); B23K 26/211 (2015.10 - EP US); B23K 26/702 (2015.10 - EP US); B23K 37/06 (2013.01 - EP US); B32B 3/26 (2013.01 - US); B32B 3/30 (2013.01 - US); B32B 15/00 (2013.01 - US); B32B 15/01 (2013.01 - EP US); F01D 5/005 (2013.01 - EP US); B23K 2101/001 (2018.07 - EP US); F05D 2230/22 (2013.01 - EP US); F05D 2230/237 (2013.01 - EP US); F05D 2250/131 (2013.01 - EP US); F05D 2250/70 (2013.01 - EP US); F05D 2260/36 (2013.01 - EP US); Y02T 50/60 (2013.01 - US); Y10T 428/12229 (2015.01 - EP US); Y10T 428/12361 (2015.01 - EP US); Y10T 428/12375 (2015.01 - EP US); Y10T 428/12382 (2015.01 - EP US); Y10T 428/12479 (2015.01 - EP US); Y10T 428/12486 (2015.01 - EP US); Y10T 428/12493 (2015.01 - EP US); Y10T 428/12931 (2015.01 - EP US); Y10T 428/12944 (2015.01 - EP US); Y10T 428/249953 (2015.04 - EP US); Y10T 428/249981 (2015.04 - EP US)
Citation (search report)
See references of WO 2010069696A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
DOCDB simple family (publication)
EP 2196276 A1 20100616; EP 2358497 A1 20110824; US 2011244264 A1 20111006; US 9144855 B2 20150929; WO 2010069696 A1 20100624
DOCDB simple family (application)
EP 08021762 A 20081215; EP 09756484 A 20091119; EP 2009065450 W 20091119; US 200913133967 A 20091119