EP 2358618 A1 20110824 - METHOD AND DEVICE FOR SEPARATING SLICED WAFERS
Title (en)
METHOD AND DEVICE FOR SEPARATING SLICED WAFERS
Title (de)
VORRICHTUNG UND VERFAHREN ZUR TRENNUNG VON WAFERSCHEIBEN
Title (fr)
PROCÉDÉ ET DISPOSITIF POUR SÉPARER DES PLAQUETTES TRANCHÉES
Publication
Application
Priority
- IL 2009001040 W 20091105
- GB 0821357 A 20081121
- IL 19996309 A 20090720
Abstract (en)
[origin: WO2010058388A1] An apparatus for separating a front wafer from a stack of wafers is disclosed. The apparatus includes a chuck for gripping the front wafer, coupled to a mechanical arm and rotatable about at least one axis with respect to the arm, so as to allow the chuck to align substantially parallel to the front wafer. A fixing mechanism is provided for fixing the chuck in a desired orientation. The apparatus also includes a drive for moving the arm in at least in two directions, one direction to bring the chuck to the front wafer and in another direction substantially parallel to the fixed orientation of the chuck to separate the wafer from the stack of wafers. A stopper mechanism is provided for preventing other wafers from separating from the stack while the front wafer is being separated.
IPC 8 full level
B65G 59/04 (2006.01)
CPC (source: EP KR)
B28D 5/0082 (2013.01 - KR); B65G 59/062 (2013.01 - EP KR); B65G 59/08 (2013.01 - EP KR); H01L 21/67092 (2013.01 - KR); H01L 21/6831 (2013.01 - KR); H01L 21/6835 (2013.01 - KR)
Citation (search report)
See references of WO 2010058388A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
DOCDB simple family (publication)
WO 2010058388 A1 20100527; CN 102292275 A 20111221; EP 2358618 A1 20110824; KR 20110086722 A 20110729
DOCDB simple family (application)
IL 2009001040 W 20091105; CN 200980155092 A 20091105; EP 09827257 A 20091105; KR 20117012769 A 20091105