EP 2359127 A1 20110824 - ELECTRONIC COMPONENT
Title (en)
ELECTRONIC COMPONENT
Title (de)
ELEKTRONISCHES BAUELEMENT
Title (fr)
COMPOSANT ÉLECTRONIQUE
Publication
Application
Priority
- EP 2009065296 W 20091117
- DE 102008043929 A 20081120
Abstract (en)
[origin: WO2010057879A1] The invention relates to an electronic component (1) comprising a conduction path structure (5) disposed on a substrate (3) and a film (7) that contacts the conduction path structure (5), wherein the film (7) has a smaller layer thickness (h) than the conduction path structure (5). The conduction path structure (5) comprises an area (11) that is covered by the film (7) for the purposes of contacting.
IPC 8 full level
G01N 27/414 (2006.01); H01R 4/02 (2006.01)
CPC (source: EP US)
G01N 27/414 (2013.01 - EP US)
Citation (search report)
See references of WO 2010057879A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
DOCDB simple family (publication)
DE 102008043929 A1 20100527; CN 102216764 A 20111012; CN 102216764 B 20140604; EP 2359127 A1 20110824; US 2011272747 A1 20111110; US 8698319 B2 20140415; WO 2010057879 A1 20100527
DOCDB simple family (application)
DE 102008043929 A 20081120; CN 200980146134 A 20091117; EP 09752374 A 20091117; EP 2009065296 W 20091117; US 99868009 A 20091117