EP 2359993 B1 20120509 - Device for die preparation for flat substrates
Title (en)
Device for die preparation for flat substrates
Title (de)
Vorrichtung zur Stanzbereitung von flächigen Substraten
Title (fr)
Dispositif de préparation d'estampillage de substrats plats
Publication
Application
Priority
DE 102010009034 A 20100224
Abstract (en)
[origin: EP2359993A1] The device has punching tool (6,7) and disposal channels (13) that are protruded from a knife holder (8) at outer side of a supporting beam (9). The disposal channels are discharged in a collecting channel (14) which is connected with a waste bin (18). The disposal channels are diverted opposite to the punching direction.
IPC 8 full level
CPC (source: EP)
B26D 7/1854 (2013.01); B26F 1/40 (2013.01)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 2359993 A1 20110824; EP 2359993 B1 20120509; AT E556825 T1 20120515; DE 102010009034 A1 20110825
DOCDB simple family (application)
EP 11000405 A 20110120; AT 11000405 T 20110120; DE 102010009034 A 20100224