EP 2360013 A1 20110824 - PROTECTIVE FILM FOR ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREFOR, AND USE THEREOF
Title (en)
PROTECTIVE FILM FOR ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREFOR, AND USE THEREOF
Title (de)
SCHUTZ FÜR EINE ELEKTRONISCHE KOMPONENTE, HERSTELLUNGSVERFAHREN DAFÜR UND VERWENDUNG DAVON
Title (fr)
FILM PROTECTEUR POUR COMPOSANT ÉLECTRONIQUE, PROCÉDÉ DE FABRICATION ASSOCIÉ, ET UTILISATION DE CE FILM PROTECTEUR
Publication
Application
Priority
- JP 2009006265 W 20091120
- JP 2008302118 A 20081127
Abstract (en)
Disclosed is a protective film for an electronic component comprising a base material containing a heat resistant resin and an adhesive layer formed on the base material containing an ethylene-unsaturated carboxylic acid copolymer or a metal salt thereof, wherein the ethylene-unsaturated carboxylic acid copolymer or the metal salt thereof contains 3 to 30% by weight of the structural unit derived from an unsaturated carboxylic acid.
IPC 8 full level
B32B 7/12 (2006.01); B32B 27/08 (2006.01); B32B 27/28 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B32B 27/36 (2006.01); C09J 7/02 (2006.01); C09J 7/35 (2018.01); G06K 19/077 (2006.01); H05K 3/28 (2006.01)
CPC (source: EP KR US)
B32B 7/12 (2013.01 - EP US); B32B 9/00 (2013.01 - EP US); B32B 9/045 (2013.01 - EP US); B32B 27/08 (2013.01 - EP US); B32B 27/10 (2013.01 - EP US); B32B 27/16 (2013.01 - EP US); B32B 27/26 (2013.01 - EP US); B32B 27/28 (2013.01 - KR); B32B 27/281 (2013.01 - EP US); B32B 27/286 (2013.01 - EP US); B32B 27/288 (2013.01 - EP US); B32B 27/308 (2013.01 - EP US); B32B 27/32 (2013.01 - EP US); B32B 27/34 (2013.01 - EP US); B32B 27/36 (2013.01 - EP US); B32B 29/00 (2013.01 - EP US); C09J 7/35 (2017.12 - EP US); C09J 131/04 (2013.01 - EP US); C09J 133/08 (2013.01 - EP US); C09J 133/10 (2013.01 - EP US); C09J 133/12 (2013.01 - EP US); G06K 19/077 (2013.01 - KR); H05K 3/28 (2013.01 - KR); H05K 3/284 (2013.01 - EP US); B32B 2307/306 (2013.01 - EP US); B32B 2307/714 (2013.01 - EP US); B32B 2307/732 (2013.01 - EP US); B32B 2457/08 (2013.01 - EP US); B32B 2457/14 (2013.01 - EP US); B32B 2553/00 (2013.01 - EP US); C09J 2203/326 (2013.01 - EP US); C09J 2301/414 (2020.08 - EP US); C09J 2423/04 (2013.01 - EP US); C09J 2433/00 (2013.01 - EP US); H05K 2203/1311 (2013.01 - EP US); H05K 2203/1322 (2013.01 - EP US); Y10T 428/2852 (2015.01 - EP US); Y10T 428/2891 (2015.01 - EP US)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
DOCDB simple family (publication)
EP 2360013 A1 20110824; EP 2360013 A4 20130116; CN 102216075 A 20111012; JP 4850309 B2 20120111; JP WO2010061563 A1 20120426; KR 101258920 B1 20130429; KR 20110079754 A 20110707; TW 201029847 A 20100816; US 2011220728 A1 20110915; WO 2010061563 A1 20100603
DOCDB simple family (application)
EP 09828813 A 20091120; CN 200980145434 A 20091120; JP 2009006265 W 20091120; JP 2010540338 A 20091120; KR 20117011963 A 20091120; TW 98140513 A 20091127; US 200913130292 A 20091120