EP 2363780 A3 20150121 - System to heat up an electronic circuit
Title (en)
System to heat up an electronic circuit
Title (de)
System zum erwärmen eines elektronischen Schaltkreises
Title (fr)
Système pour réchauffer un circuit électronique
Publication
Application
Priority
DE 102010009736 A 20100301
Abstract (en)
[origin: EP2363780A2] The module (1) has an electronic circuit (2) e.g. processor, for processing data, and a temperature measuring device (5) for determining temperature characteristics of the circuit. The circuit is operated in a warming mode when the determined characteristics fulfill preset conditions, where energy saving operations are executed in the circuit in the warming mode such that the circuit is held at medium temperature. The warming mode is designed such that the operations are executed in the circuit, where the operations have no function that exceeds preset heat recovery of the circuit. An independent claim is also included for a method for warming an electronic circuit of a machine-to-machine (M2M) communication module.
IPC 8 full level
G06F 1/20 (2006.01); H01L 23/34 (2006.01); H05K 1/02 (2006.01)
CPC (source: EP)
G06F 1/206 (2013.01); H01L 23/34 (2013.01); H01L 23/345 (2013.01); H01L 2924/0002 (2013.01); H05K 1/0212 (2013.01); Y02D 10/00 (2017.12)
Citation (search report)
- [XI] DE 102005061358 A1 20070705 - SIEMENS AG [DE]
- [XI] DE 10034262 C1 20010920 - INFINEON TECHNOLOGIES AG [DE]
- [A] DE 102008026135 A1 20091203 - ADVANCED MICRO DEVICES INC [US], et al
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 2363780 A2 20110907; EP 2363780 A3 20150121; DE 102010009736 A1 20110901
DOCDB simple family (application)
EP 11001584 A 20110225; DE 102010009736 A 20100301