EP 2366460 A2 20110921 - Method for manufacturing ultrasonic sensor, ultrasonic sensor, and banknote handling apparatus comprising ultrasonic sensor
Title (en)
Method for manufacturing ultrasonic sensor, ultrasonic sensor, and banknote handling apparatus comprising ultrasonic sensor
Title (de)
Verfahren zur Herstellung eines Ultraschallsensors, Ultraschallsensor und Banknotenbehandlungsvorrichtung mit dem Ultraschallsensor
Title (fr)
Procédé de fabrication de capteur à ultrasons, capteur à ultrasons et appareil de manipulation de billets de banque comportant un capteur à ultrasons
Publication
Application
Priority
JP 2010063325 A 20100318
Abstract (en)
According to one embodiment, a method for manufacturing an ultrasonic sensor includes forming a first conductive layer (632a) on one side of a piezoelectric body (631) having opposing sides; forming a second conductive layer (632b) on the other side of the piezoelectric body (631); forming a backing layer (640) on the first conductive layer (632a); forming a matching layer (610) of a size corresponding to a size of a conveyed object to be detected on the second conductive layer; and providing at least one incision (G) that cuts through the first conductive layer (632a), the piezoelectric body (631), the second conductive layer (632b) and the matching layer (610), the incisions (G) having a depth extending from the matching layer (610) to at least the first conductive layer (632a), to form a plurality of channels (C).
IPC 8 full level
B06B 1/06 (2006.01); G01N 29/04 (2006.01); G01N 29/24 (2006.01); G07D 7/08 (2006.01); G07D 7/16 (2006.01); G07D 11/00 (2006.01); H04R 17/00 (2006.01); H04R 31/00 (2006.01)
CPC (source: EP US)
G01N 29/043 (2013.01 - EP US); G07D 7/08 (2013.01 - EP US); H10N 30/06 (2023.02 - EP US); H10N 30/088 (2023.02 - EP US); G01N 2291/0237 (2013.01 - EP US); G01N 2291/044 (2013.01 - EP US); G01N 2291/051 (2013.01 - EP US); Y10T 29/42 (2015.01 - EP US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 2366460 A2 20110921; CN 102194274 A 20110921; JP 2011199529 A 20111006; US 2011231009 A1 20110922
DOCDB simple family (application)
EP 10195162 A 20101215; CN 201010593216 A 20101217; JP 2010063325 A 20100318; US 96754110 A 20101214