Global Patent Index - EP 2370211 A1

EP 2370211 A1 20111005 - COMPONENTS FOR HIGH TEMPERATURE APPLICATIONS

Title (en)

COMPONENTS FOR HIGH TEMPERATURE APPLICATIONS

Title (de)

BAUTEILE FÜR HOCHTEMPERATURANWENDUNGEN

Title (fr)

ÉLÉMENTS POUR DES APPLICATIONS À TEMPÉRATURE ÉLEVÉE

Publication

EP 2370211 A1 20111005 (DE)

Application

EP 09764801 A 20091202

Priority

  • EP 2009066273 W 20091202
  • DE 102008059908 A 20081202
  • DE 102009044340 A 20091027

Abstract (en)

[origin: WO2010063776A1] The invention relates to a method for producing components, which method is characterized by the following steps: a) making a blank available; b) applying an inorganic-organic hybrid polymer layer to a surface of the blank; c) heating the coated blank to cure the polymer layer; and cooling the coated blank. The invention further relates to a component, especially for the use in domestic appliances, and to the use of said component.

IPC 8 full level

B05D 3/02 (2006.01); B05D 3/06 (2006.01); B05D 5/08 (2006.01); C23C 18/12 (2006.01); C23C 24/08 (2006.01)

CPC (source: EP KR US)

B05D 3/02 (2013.01 - KR); B05D 5/08 (2013.01 - KR); B05D 7/14 (2013.01 - EP US); C23C 18/12 (2013.01 - KR); C23C 18/122 (2013.01 - EP US); C23C 18/1233 (2013.01 - EP US); C23C 18/1254 (2013.01 - EP US); C23C 18/127 (2013.01 - EP US); C23C 18/1283 (2013.01 - EP US); C23C 18/1295 (2013.01 - EP US); C23C 18/143 (2019.04 - EP US); C23C 24/08 (2013.01 - KR); C23C 26/00 (2013.01 - EP US); B05D 3/0254 (2013.01 - EP US); Y10T 428/269 (2015.01 - EP US)

Citation (search report)

See references of WO 2010063776A1

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

DOCDB simple family (publication)

DE 102009044340 A1 20100610; CN 102239011 A 20111109; CN 102239011 B 20131023; EP 2370211 A1 20111005; EP 2370211 B1 20160928; JP 2012510358 A 20120510; JP 5548994 B2 20140716; KR 20110099125 A 20110906; US 2011236680 A1 20110929; WO 2010063776 A1 20100610

DOCDB simple family (application)

DE 102009044340 A 20091027; CN 200980148263 A 20091202; EP 09764801 A 20091202; EP 2009066273 W 20091202; JP 2011538011 A 20091202; KR 20117015466 A 20091202; US 200913132331 A 20091202