Global Patent Index - EP 2377172 A1

EP 2377172 A1 20111019 - METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT AND OPTOELECTRONIC COMPONENT

Title (en)

METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT AND OPTOELECTRONIC COMPONENT

Title (de)

VERFAHREN ZUR HERSTELLUNG EINES OPTOELEKTRONISCHEN BAUTEILS UND OPTOELEKTRONISCHES BAUTEIL

Title (fr)

PROCÉDÉ DE FABRICATION D'UN ÉLÉMENT OPTOÉLECTRONIQUE ET ÉLÉMENT OPTOÉLECTRONIQUE

Publication

EP 2377172 A1 20111019 (DE)

Application

EP 09801651 A 20091102

Priority

  • DE 2009001549 W 20091102
  • DE 102009004724 A 20090115

Abstract (en)

[origin: WO2010081445A1] In at least one embodiment of the method for producing an optoelectronic component (1), said method comprises the following steps: - providing a carrier (2), - applying at least one first metal layer (11) on the carrier (2), - providing at least one optical component (3), - applying at least one second metal layer (12) onto the at least one optical component (3), and - mechanically connecting the carrier (2) to the at least one optical component (3) by way of the at least one first and the at least one second metal layer (11, 12), wherein the connecting includes friction welding or is done by friction welding.

IPC 8 full level

H01L 21/50 (2006.01); H01L 23/04 (2006.01); H01L 23/10 (2006.01); H01L 33/48 (2010.01); H01L 33/58 (2010.01); H01S 5/022 (2006.01)

CPC (source: EP KR US)

H01L 33/48 (2013.01 - KR); H01L 33/483 (2013.01 - EP US); H01L 33/58 (2013.01 - KR); H01L 21/50 (2013.01 - EP US); H01L 23/04 (2013.01 - EP US); H01L 23/10 (2013.01 - EP US); H01L 33/58 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US); H01S 5/0237 (2021.01 - EP US)

Citation (search report)

See references of WO 2010081445A1

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

DOCDB simple family (publication)

DE 102009004724 A1 20100722; CN 102282686 A 20111214; EP 2377172 A1 20111019; JP 2012515441 A 20120705; KR 20110118765 A 20111101; US 2011285017 A1 20111124; US 8450847 B2 20130528; WO 2010081445 A1 20100722

DOCDB simple family (application)

DE 102009004724 A 20090115; CN 200980154617 A 20091102; DE 2009001549 W 20091102; EP 09801651 A 20091102; JP 2011545619 A 20091102; KR 20117011021 A 20091102; US 200913126096 A 20091102