EP 2377379 A1 20111019 - HEAT TRANSFER ARRANGEMENT AND ELECTRONIC HOUSING COMPRISING A HEAT TRANSFER ARRANGEMENT AND METHOD OF CONTROLLING HEAT TRANSFER
Title (en)
HEAT TRANSFER ARRANGEMENT AND ELECTRONIC HOUSING COMPRISING A HEAT TRANSFER ARRANGEMENT AND METHOD OF CONTROLLING HEAT TRANSFER
Title (de)
WÄRMEÜBERTRAGUNGSANORDNUNG UND ELEKTRONISCHES GEHÄUSE MIT EINER WÄRMEÜBERTRAGUNGSANORDNUNG UND VERFAHREN ZUR STEUERUNG VON WÄRMEÜBERTRAGUNG
Title (fr)
AGENCEMENT DE TRANSFERT DE CHALEUR ET BOÎTIER ÉLECTRONIQUE COMPRENANT UN AGENCEMENT DE TRANSFERT DE CHALEUR ET PROCÉDÉ DE COMMANDE DE TRANSFERT DE CHALEUR
Publication
Application
Priority
SE 2009050028 W 20090115
Abstract (en)
[origin: WO2010082875A1] A heat transfer arrangement comprises a refrigerant circuit (102). The refrigerant circuit (102) comprises an evaporator (104) adapted to be arranged inside an electronic component housing (202), a condenser (108) adapted to be arranged outside the electronic component housing (202), a first conduit leading (106) from the evaporator (104) to the condenser (108), and a second conduit leading from the condenser (108) to the evaporator (104). A refrigerant is present in the refrigerant circuit (102) and in use, under first temperature conditions, is arranged to self-circulate in the refrigerant circuit (102) by evaporating in the evaporator (104), rising as a gas through the first conduit, condensing in the condenser (108) and flowing through the second conduit to the evaporator (104). In the refrigerant circuit (102) a further separate gas or separate gas mixture is present in a quantity such that in use, under second temperature conditions, said quantity of further separate gas or separate gas mixture expands inside the condenser (108) to thereby displace refrigerant from the condenser (108). Heat transfer is thus controlled. Also an electronic component housing comprising such a heat transfer arrangement and a method of controlling heat transfer from such an electronic housing are provided.
IPC 8 full level
H05K 7/20 (2006.01)
CPC (source: EP US)
F28D 15/0266 (2013.01 - EP US); F28D 15/06 (2013.01 - EP US); H05K 7/2029 (2013.01 - EP US)
Citation (search report)
See references of WO 2010082875A1
Citation (examination)
- US 2003183381 A1 20031002 - GARNER SCOTT D [US], et al
- US 2003180589 A1 20030925 - SARRAF DAVID B [US], et al
- US 5289869 A 19940301 - KLEIN JOHN F [US], et al
- US 3958627 A 19760525 - EDELSTEIN FREDERICK
- US 3672443 A 19720627 - BIENERT WALTER B, et al
- US 5771967 A 19980630 - HYMAN NELSON L [US]
- MOAVENINEJADA & M M HEYHATA S: "Study of a Variable Conductance Two-Phase Closed Thermosyphon With Two-Component Working Fluid", HEAT TRANSFER ENGINEERING, HEMISPHERE PUB, WASHINGTON, DC, US, vol. 31, no. 13, 1 January 2010 (2010-01-01), pages 1082 - 1090, XP008162798, ISSN: 0145-7632, [retrieved on 20111012], DOI: 10.1080/01457631003640347
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2010082875 A1 20100722; EP 2377379 A1 20111019; US 2011271696 A1 20111110
DOCDB simple family (application)
SE 2009050028 W 20090115; EP 09788464 A 20090115; US 200913144658 A 20090115