EP 2379998 A1 20111026 - DEVICE AND METHOD FOR PRODUCING A DEVICE
Title (en)
DEVICE AND METHOD FOR PRODUCING A DEVICE
Title (de)
VORRICHTUNG UND VERFAHREN ZUR HERSTELLUNG EINER VORRICHTUNG
Title (fr)
DISPOSITIF ET PROCÉDÉ DE FABRICATION DU DISPOSITIF
Publication
Application
Priority
- EP 2009064394 W 20091030
- DE 102008054743 A 20081216
Abstract (en)
[origin: WO2010072455A1] The invention relates to a device, particularly a sensor device, having a structural element, a carrier element and a housing, wherein the structural element is arranged on the carrier element, and wherein the structural element and the carrier element are arranged at least partially within the housing, and wherein the device furthermore has an intermediate housing that is arranged substantially between the housing and the structural element, wherein the intermediate housing comprises a pre-mold housing.
IPC 8 full level
G01L 19/14 (2006.01); B81B 7/00 (2006.01); B81C 1/00 (2006.01); H01L 23/057 (2006.01)
CPC (source: EP US)
B29C 45/14467 (2013.01 - EP US); B29C 45/14639 (2013.01 - EP US); B81C 1/00325 (2013.01 - EP US); G01L 19/141 (2013.01 - EP US); B81B 2201/0264 (2013.01 - EP US); B81B 2207/098 (2013.01 - EP US); B81C 2203/0154 (2013.01 - EP US)
Citation (search report)
See references of WO 2010072455A1
Citation (examination)
EP 1376090 A1 20040102 - HITACHI LTD [JP]
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
DOCDB simple family (publication)
DE 102008054743 A1 20100617; CN 102257374 A 20111123; CN 102257374 B 20141224; EP 2379998 A1 20111026; JP 2012512405 A 20120531; US 2011290016 A1 20111201; US 8621925 B2 20140107; WO 2010072455 A1 20100701
DOCDB simple family (application)
DE 102008054743 A 20081216; CN 200980150896 A 20091030; EP 09749066 A 20091030; EP 2009064394 W 20091030; JP 2011541251 A 20091030; US 99880009 A 20091030