Global Patent Index - EP 2382659 A1

EP 2382659 A1 20111102 - ELECTRICAL OR ELECTRONIC COMPOSITE COMPONENT AND METHOD FOR PRODUCING AN ELECTRICAL OR ELECTRONIC COMPOSITE COMPONENT

Title (en)

ELECTRICAL OR ELECTRONIC COMPOSITE COMPONENT AND METHOD FOR PRODUCING AN ELECTRICAL OR ELECTRONIC COMPOSITE COMPONENT

Title (de)

ELEKTRISCHES ODER ELEKTRONISCHES VERBUNDBAUTEIL SOWIE VERFAHREN ZUM HERSTELLEN EINES ELEKTRISCHEN ODER ELEKTRONISCHEN VERBUNDBAUTEILS

Title (fr)

COMPOSANT ÉLECTRIQUE OU ÉLECTRONIQUE COMPOSITE ET PROCÉDÉ DE FABRICATION D'UN COMPOSANT ÉLECTRIQUE OU ÉLECTRONIQUE COMPOSITE

Publication

EP 2382659 A1 20111102 (DE)

Application

EP 09764842 A 20091207

Priority

  • EP 2009066518 W 20091207
  • DE 102008055134 A 20081223

Abstract (en)

[origin: WO2010072555A1] The invention relates to an electrical or electronic composite component (1), comprising a first joining partner (2) and at least one second joining partner (3). According to the invention, an openly porous sintered molding (6, 7) is held between the first and the second joining partners (2, 3) and is firmly connected to the first and the second joining partners (2, 3).

IPC 8 full level

H01L 23/36 (2006.01); H01L 23/373 (2006.01)

CPC (source: EP US)

H01L 23/3735 (2013.01 - EP US); H01L 24/48 (2013.01 - EP US); H01L 2224/2908 (2013.01 - EP US); H01L 2224/29339 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48137 (2013.01 - EP US); H01L 2224/48227 (2013.01 - EP US); H01L 2224/48472 (2013.01 - EP US); H01L 2224/83101 (2013.01 - EP US); H01L 2224/83205 (2013.01 - EP US); H01L 2224/8384 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/12041 (2013.01 - EP US); H01L 2924/12042 (2013.01 - EP US); H01L 2924/1305 (2013.01 - EP US); H01L 2924/13055 (2013.01 - EP US); H01L 2924/13062 (2013.01 - EP US); H01L 2924/13091 (2013.01 - EP US); H01L 2924/1461 (2013.01 - EP US); H01L 2924/181 (2013.01 - EP US); Y10T 156/10 (2015.01 - EP US)

Citation (search report)

See references of WO 2010072555A1

Citation (examination)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

DOCDB simple family (publication)

DE 102008055134 A1 20100701; AU 2009331707 A1 20100701; CN 102265393 A 20111130; EP 2382659 A1 20111102; JP 2012513682 A 20120614; JP 5602763 B2 20141008; US 2011304985 A1 20111215; WO 2010072555 A1 20100701

DOCDB simple family (application)

DE 102008055134 A 20081223; AU 2009331707 A 20091207; CN 200980152200 A 20091207; EP 09764842 A 20091207; EP 2009066518 W 20091207; JP 2011542749 A 20091207; US 200913141947 A 20091207