EP 2382660 A1 20111102 - ELECTRICAL OR ELECTRONIC COMPOSITE COMPONENT AND METHOD FOR PRODUCING AN ELECTRICAL OR ELECTRONIC COMPOSITE COMPONENT
Title (en)
ELECTRICAL OR ELECTRONIC COMPOSITE COMPONENT AND METHOD FOR PRODUCING AN ELECTRICAL OR ELECTRONIC COMPOSITE COMPONENT
Title (de)
ELEKTRISCHES ODER ELEKTRONISCHES VERBUNDBAUTEIL SOWIE VERFAHREN ZUM HERSTELLEN EINES ELEKTRISCHEN ODER ELEKTRONISCHEN VERBUNDBAUTEILS
Title (fr)
ÉLÉMENT COMPOSITE ÉLECTRIQUE OU ÉLECTRONIQUE ET PROCÉDÉ DE FABRICATION D'UN ÉLÉMENT COMPOSITE ÉLECTRIQUE OU ÉLECTRONIQUE
Publication
Application
Priority
- EP 2009067498 W 20091218
- DE 102008055137 A 20081223
Abstract (en)
[origin: WO2010072667A1] The invention relates to an electrical and electronic composite component (1), comprising a first joining partner (2) and at least one second joining partner (3). The invention provides for an openly porous sintered shaped part (6, 7) to be accommodated between the first and the second joining partners (2, 3), said sintered shaped part being sintered by sintering by means of sintering paste with the first and the second joining partners (2, 3). The invention furthermore relates to a production method.
IPC 8 full level
H01L 23/373 (2006.01)
CPC (source: EP US)
H01L 23/3735 (2013.01 - EP US); H01L 24/05 (2013.01 - EP US); H01L 24/29 (2013.01 - EP US); H01L 24/83 (2013.01 - EP US); H01L 25/072 (2013.01 - EP US); H05K 3/0061 (2013.01 - EP US); H01L 23/049 (2013.01 - EP US); H01L 23/24 (2013.01 - EP US); H01L 24/03 (2013.01 - EP US); H01L 24/27 (2013.01 - EP US); H01L 24/30 (2013.01 - EP US); H01L 24/48 (2013.01 - EP US); H01L 2224/03505 (2013.01 - EP US); H01L 2224/04026 (2013.01 - EP US); H01L 2224/04034 (2013.01 - EP US); H01L 2224/04042 (2013.01 - EP US); H01L 2224/05639 (2013.01 - EP US); H01L 2224/271 (2013.01 - EP US); H01L 2224/27505 (2013.01 - EP US); H01L 2224/29 (2013.01 - EP US); H01L 2224/29101 (2013.01 - EP US); H01L 2224/29111 (2013.01 - EP US); H01L 2224/29113 (2013.01 - EP US); H01L 2224/29116 (2013.01 - EP US); H01L 2224/29139 (2013.01 - EP US); H01L 2224/29144 (2013.01 - EP US); H01L 2224/29298 (2013.01 - EP US); H01L 2224/30181 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48137 (2013.01 - EP US); H01L 2224/48227 (2013.01 - EP US); H01L 2224/48472 (2013.01 - EP US); H01L 2224/83101 (2013.01 - EP US); H01L 2224/83191 (2013.01 - EP US); H01L 2224/83192 (2013.01 - EP US); H01L 2224/83193 (2013.01 - EP US); H01L 2224/83203 (2013.01 - EP US); H01L 2224/83801 (2013.01 - EP US); H01L 2224/8384 (2013.01 - EP US); H01L 2924/00013 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/01004 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01047 (2013.01 - EP US); H01L 2924/01063 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/0133 (2013.01 - EP US); H01L 2924/014 (2013.01 - EP US); H01L 2924/1203 (2013.01 - EP US); H01L 2924/1305 (2013.01 - EP US); H01L 2924/13055 (2013.01 - EP US); H01L 2924/13062 (2013.01 - EP US); H01L 2924/13091 (2013.01 - EP US); H01L 2924/1461 (2013.01 - EP US); H01L 2924/15747 (2013.01 - EP US); H01L 2924/181 (2013.01 - EP US); H01L 2924/3512 (2013.01 - EP US); H05K 1/0306 (2013.01 - EP US); H05K 2203/1131 (2013.01 - EP US); Y10T 29/49002 (2015.01 - EP US); Y10T 428/249953 (2015.04 - EP US)
Citation (search report)
See references of WO 2010072667A1
Citation (examination)
- EP 0275433 A1 19880727 - SIEMENS AG [DE]
- JP 3120826 B2 20001225
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
DOCDB simple family (publication)
DE 102008055137 A1 20100701; CN 102272921 A 20111207; EP 2382660 A1 20111102; JP 2012513683 A 20120614; US 2012028025 A1 20120202; WO 2010072667 A1 20100701
DOCDB simple family (application)
DE 102008055137 A 20081223; CN 200980151786 A 20091218; EP 09799096 A 20091218; EP 2009067498 W 20091218; JP 2011542785 A 20091218; US 200913141756 A 20091218