EP 2388219 A3 20121219 - Method and device for applying RFID chips to a roll of material
Title (en)
Method and device for applying RFID chips to a roll of material
Title (de)
Verfahren und Vorrichtung zum Bestücken einer Materialbahnrolle mit RFID-Chips
Title (fr)
Procédé et dispositif d'alimentation d'un rouleau de matériau en puces RFID
Publication
Application
Priority
- DE 102010029101 A 20100519
- DE 102010044154 A 20101119
Abstract (en)
[origin: EP2388219A2] The method involves loading a Radio frequency identification (RFID)chip (5,6) during the winding of a material web. The loading operation is performed at the beginning or at the end of the winding operation. The RFID-chip is embedded in an adhesive track. The material web is defined on the outer periphery of material web rolls. An independent claim is also included for an apparatus for loading a material web roll with radio frequency identification chip.
IPC 8 full level
B65H 19/28 (2006.01); B65H 19/29 (2006.01); B65H 75/18 (2006.01)
CPC (source: EP)
B65H 19/286 (2013.01); B65H 19/29 (2013.01); B65H 75/182 (2013.01); B65H 2301/41484 (2013.01); B65H 2511/12 (2013.01); B65H 2553/52 (2013.01)
Citation (search report)
- [X] US 2003025027 A1 20030206 - EBISAWA RYOJI [JP], et al
- [X] EP 1803671 A2 20070704 - NRC INTERNAT INC [US]
- [X] EP 1947591 A1 20080723 - BROTHER IND LTD [JP]
- [X] EP 1538084 A1 20050608 - ISHIDA SEISAKUSHO [JP]
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 2388219 A2 20111123; EP 2388219 A3 20121219; CN 102275764 A 20111214; DE 102010044154 A1 20111124
DOCDB simple family (application)
EP 11158762 A 20110318; CN 201110130068 A 20110519; DE 102010044154 A 20101119