EP 2392220 A1 20111207 - Insole comprising an electronic chip
Title (en)
Insole comprising an electronic chip
Title (de)
Einlegesohle, der einen elektronischen Chip umfasst
Title (fr)
Semelle intérieure comportant une puce électronique
Publication
Application
Priority
EP 10005748 A 20100602
Abstract (en)
The present invention relates to an innersole (1), in particular for a sports shoe, and shoe comprising an electronic chip (2). In order to provide a shoe, in particular a sports shoe, with an electronic chip in a more cost efficient way compared to the prior art, wherein the chip can easily be replaced or removed in case of failure or for recycling, the invention provides an innersole, in particular for a sports shoe, wherein the innersole comprises an electronic chip. It may be fitted into any kinds of shoes and may be readily replaced or removed, as is not an inherent part of the shoe.
IPC 8 full level
A43B 3/00 (2006.01); A43B 17/00 (2006.01)
CPC (source: EP)
A43B 3/34 (2022.01); A43B 17/00 (2013.01)
Citation (applicant)
- DE 202004012749 U1 20041014 - ILLIAN HOLGER [DE]
- FR 2855725 A1 20041210 - COEURET BERNARD [FR]
Citation (search report)
- [X] US 2007033838 A1 20070215 - LUCE NICOLA J [US], et al
- [X] US 2007260421 A1 20071108 - BERNER WILLIAM E JR [US], et al
- [X] US 2005261609 A1 20051124 - COLLINGS TIMOTHY D [CA], et al
- [X] US 2001049890 A1 20011213 - HIRSCH JOHN [US], et al
- [XD] DE 202004012749 U1 20041014 - ILLIAN HOLGER [DE]
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
Designated extension state (EPC)
BA ME RS
DOCDB simple family (publication)
DOCDB simple family (application)
EP 10005748 A 20100602