EP 2396795 A1 20111221 - CERAMIC ELECTRONIC MULTILAYER COMPONENT AND METHOD FOR THE PRODUCTION THEREOF
Title (en)
CERAMIC ELECTRONIC MULTILAYER COMPONENT AND METHOD FOR THE PRODUCTION THEREOF
Title (de)
KERAMISCHES ELEKTRONISCHES MEHRSCHICHTBAUELEMENT UND VERFAHREN ZU DESSEN HERSTELLUNG
Title (fr)
COMPOSANT ÉLECTRONIQUE CÉRAMIQUE À COUCHES MULTIPLES ET SON PROCÉDÉ DE FABRICATION
Publication
Application
Priority
- EP 2010051518 W 20100208
- DE 102009008737 A 20090212
- DE 102009014542 A 20090324
Abstract (en)
[origin: WO2010092027A1] The invention relates to a multilayer component that comprises a dielectric ceramic material that can be co-sintered with a varistor ceramic to form a monolithic multilayer component according to the invention. Therefore, the multilayer component comprises a layer of a varistor ceramic and another layer of a dielectric. The two layers can be arranged directly adjacent in the multilayer component. In the multilayer component, metallizations that are structured to form conductor sections and metallized surfaces are arranged on or between the ceramic layers. In addition to a varistor, the metallizations, together with the ceramic layers, also form at least one further component that is selected from at least one of the component functions of capacitance, resistance, and inductance.
IPC 8 full level
CPC (source: EP US)
B32B 18/00 (2013.01 - EP US); C04B 35/453 (2013.01 - EP US); C04B 35/495 (2013.01 - EP US); H01C 7/18 (2013.01 - EP US); H01G 4/1209 (2013.01 - EP US); C04B 2235/3241 (2013.01 - EP US); C04B 2235/3251 (2013.01 - EP US); C04B 2235/3275 (2013.01 - EP US); C04B 2235/3279 (2013.01 - EP US); C04B 2235/3284 (2013.01 - EP US); C04B 2235/3294 (2013.01 - EP US); C04B 2235/3298 (2013.01 - EP US); C04B 2237/34 (2013.01 - EP US); C04B 2237/345 (2013.01 - EP US); H03H 2001/0085 (2013.01 - US)
Citation (search report)
See references of WO 2010092027A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
DOCDB simple family (publication)
WO 2010092027 A1 20100819; CN 102318017 A 20120111; CN 102318017 B 20130529; DE 102009014542 B3 20101202; EP 2396795 A1 20111221; JP 2012517710 A 20120802; JP 5912533 B2 20160427; TW 201040020 A 20101116; TW I454378 B 20141001; US 2012032757 A1 20120209; US 8970324 B2 20150303
DOCDB simple family (application)
EP 2010051518 W 20100208; CN 201080007615 A 20100208; DE 102009014542 A 20090324; EP 10703456 A 20100208; JP 2011549531 A 20100208; TW 99103760 A 20100208; US 201013201173 A 20100208