EP 2396815 A4 20121128 - DETECTING DEFECTS ON A WAFER
Title (en)
DETECTING DEFECTS ON A WAFER
Title (de)
ERKENNUNG VON DEFEKTEN AUF EINEM WAFER
Title (fr)
DÉTECTION DES DÉFAUTS SUR UNE TRANCHE
Publication
Application
Priority
- US 2010023802 W 20100210
- US 15247709 P 20090213
Abstract (en)
[origin: WO2010093733A2] Methods and systems for detecting defects on a wafer are provided.
IPC 8 full level
H01L 21/66 (2006.01); G01N 21/88 (2006.01); G01N 21/95 (2006.01); G01N 21/956 (2006.01)
CPC (source: EP KR)
G01N 21/8806 (2013.01 - KR); G01N 21/9501 (2013.01 - EP KR); H01L 22/12 (2013.01 - EP KR); G01N 21/8806 (2013.01 - EP); H01L 2924/0002 (2013.01 - EP KR)
Citation (search report)
- [I] US 2009037134 A1 20090205 - KULKARNI ASHOK [US], et al
- [A] US 2004246476 A1 20041209 - BEVIS CHRISTOPHER F [US], et al
- See references of WO 2010093733A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
DOCDB simple family (publication)
WO 2010093733 A2 20100819; WO 2010093733 A3 20101028; CN 102396058 A 20120328; CN 102396058 B 20140820; EP 2396815 A2 20111221; EP 2396815 A4 20121128; IL 214488 A0 20110927; IL 214488 A 20160421; JP 2012518278 A 20120809; JP 5570530 B2 20140813; KR 101674698 B1 20161109; KR 20110124303 A 20111116; SG 173586 A1 20110929
DOCDB simple family (application)
US 2010023802 W 20100210; CN 201080016422 A 20100210; EP 10741683 A 20100210; IL 21448811 A 20110807; JP 2011550208 A 20100210; KR 20117021145 A 20100210; SG 2011056926 A 20100210