Global Patent Index - EP 2397302 B1

EP 2397302 B1 20150218 - Injection molding method and injection molding machine

Title (en)

Injection molding method and injection molding machine

Title (de)

Spritzgießverfahren und Spritzgießmaschine

Title (fr)

Procédé de moulage par injection et machine à moulage par injection

Publication

EP 2397302 B1 20150218 (EN)

Application

EP 11004895 A 20110615

Priority

JP 2010136028 A 20100615

Abstract (en)

[origin: EP2397302A1] It may be possible to suppress the clogging of a gas vent, to simplify the maintenance of a mold device, and to improve the preform productivity. The invention may be applied to an injection molding machine including a split mold where a gas discharge portion is formed at parting surfaces. Further, the cross-section of a flow passage of the gas discharge portion is reduced at a predetermined timing after the start of the filling of a molding material. Since the cross-section of the flow passage of the gas discharge portion is reduced after a cavity space starts being filled with a molding material, it may be possible to make the amount of gas, which flows through the gas discharge portion, large until the cross-section of the flow passage of the gas discharge portion is reduced. It may be possible to prevent a foreign material from adhering to the inner peripheral surface of the gas discharge portion.

IPC 8 full level

B29C 45/34 (2006.01); B29C 45/56 (2006.01); B29C 45/76 (2006.01)

CPC (source: EP US)

B29C 45/34 (2013.01 - EP US); B29C 45/56 (2013.01 - EP US); B29C 45/7653 (2013.01 - EP US); B29K 2105/253 (2013.01 - EP US)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

EP 2397302 A1 20111221; EP 2397302 B1 20150218; CA 2742230 A1 20111215; CA 2742230 C 20150811; CN 102328404 A 20120125; CN 102328404 B 20160120; JP 2012000803 A 20120105; JP 5684498 B2 20150311; US 2011304077 A1 20111215; US 8709326 B2 20140429

DOCDB simple family (application)

EP 11004895 A 20110615; CA 2742230 A 20110602; CN 201110161078 A 20110615; JP 2010136028 A 20100615; US 201113158847 A 20110613