Global Patent Index - EP 2406034 A1

EP 2406034 A1 20120118 - CORED WIRE ELECTRODE

Title (en)

CORED WIRE ELECTRODE

Title (de)

FÜLLDRAHTELEKTRODE

Title (fr)

FIL-ÉLECTRODE FOURRÉ

Publication

EP 2406034 A1 20120118 (DE)

Application

EP 10710154 A 20100308

Priority

  • AT 2010000070 W 20100308
  • AT 3932009 A 20090311

Abstract (en)

[origin: WO2010102318A1] The invention relates to a cored wire electrode for producing a high-strength melt/weld bond and describes a method for manufacturing cored wire electrodes having a diameter of less than 2 mm. In order to prevent oxidation and water absorption of the powder and preserve the original thermal reaction potential of the mineral constituents of the same, according to the invention the cored wire electrode is characterized in that in the longitudinal direction the cold-formed metal tube has a leak-proof melt/weld bond or a weld seam which has lower fusion penetration than the tube wall is thick and in this way a distance of the metal bond of the tube wall to the powder core is formed.

IPC 8 full level

B23K 35/02 (2006.01); B23K 35/40 (2006.01)

CPC (source: EP US)

B23K 9/24 (2013.01 - EP US); B23K 35/0227 (2013.01 - EP US); B23K 35/0244 (2013.01 - EP US); B23K 35/0261 (2013.01 - EP US); B23K 35/0266 (2013.01 - EP US); B23K 35/3053 (2013.01 - EP US); B23K 35/3602 (2013.01 - EP US); B23K 35/3605 (2013.01 - EP US); B23K 35/406 (2013.01 - EP US); B23K 2035/408 (2013.01 - EP US); B23K 2103/04 (2018.07 - EP US)

Citation (search report)

See references of WO 2010102318A1

Citation (examination)

DE 60130958 T2 20080717 - AIR LIQUIDE [FR], et al

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

DOCDB simple family (publication)

DE 202009007217 U1 20090827; AT 507914 A1 20100915; AT 507914 B1 20101115; EP 2406034 A1 20120118; JP 2012519598 A 20120830; US 2012061354 A1 20120315; US 8963047 B2 20150224; WO 2010102318 A1 20100916; WO 2010102318 A8 20110818

DOCDB simple family (application)

DE 202009007217 U 20090520; AT 2010000070 W 20100308; AT 3932009 A 20090311; EP 10710154 A 20100308; JP 2012502385 A 20100308; US 201013255788 A 20100308