EP 2406827 A1 20120118 - ENCAPSULATED OPTOELECTRONIC SEMICONDUCTOR COMPONENT
Title (en)
ENCAPSULATED OPTOELECTRONIC SEMICONDUCTOR COMPONENT
Title (de)
VERGOSSENES OPTOELEKTRONISCHES HALBLEITERBAUELEMENT
Title (fr)
COMPOSANT SEMI-CONDUCTEUR OPTOÉLECTRONIQUE ENCAPSULÉ
Publication
Application
Priority
- EP 2009067890 W 20091223
- DE 102009012517 A 20090310
Abstract (en)
[origin: WO2010102685A1] The invention relates to an optoelectronic semiconductor component (100) having - a carrier (1) comprising a mounting surface (11) and at least one penetration (3), wherein the penetration (3) extends from the mounting surface (11) to a base surface (12) of the carrier opposite the mounting surface (11); - at least one optoelectronic semiconductor chip (2) mounted on the mounting surface (11); - a cast body (5) transparent to radiation enclosing the at least one optoelectronic semiconductor chip (2) at least in places, wherein - the cast body (5) is disposed at least in places in the penetration (3) of the carrier (1).
IPC 8 full level
H01L 31/0203 (2006.01); H01L 33/48 (2010.01); H01L 33/52 (2010.01); H01L 33/54 (2010.01)
CPC (source: CN EP US)
H01L 31/0203 (2013.01 - CN EP US); H01L 33/54 (2013.01 - CN EP US); H01L 33/483 (2013.01 - CN EP US); H01L 2924/0002 (2013.01 - CN EP US)
Citation (search report)
See references of WO 2010102685A1
Citation (examination)
JP 2007027433 A 20070201 - MITSUBISHI CABLE IND LTD
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
DOCDB simple family (publication)
DE 102009012517 A1 20100916; CN 102349160 A 20120208; CN 102349160 B 20140507; CN 103928593 A 20140716; EP 2406827 A1 20120118; JP 2012519973 A 20120830; JP 5611246 B2 20141022; KR 101712220 B1 20170303; KR 20110137348 A 20111222; TW 201112457 A 20110401; TW 201532318 A 20150816; TW I489660 B 20150621; TW I580081 B 20170421; US 2012119250 A1 20120517; US 8946756 B2 20150203; WO 2010102685 A1 20100916
DOCDB simple family (application)
DE 102009012517 A 20090310; CN 200980158010 A 20091223; CN 201410114106 A 20091223; EP 09799360 A 20091223; EP 2009067890 W 20091223; JP 2011553292 A 20091223; KR 20117023675 A 20091223; TW 104115198 A 20100208; TW 99103759 A 20100208; US 200913256213 A 20091223