EP 2406835 A4 20130918 - LED LEADFRAME PACKAGE, LED PACKAGE USING THE SAME, AND METHOD OF MANUFACTURING THE LED PACKAGE
Title (en)
LED LEADFRAME PACKAGE, LED PACKAGE USING THE SAME, AND METHOD OF MANUFACTURING THE LED PACKAGE
Title (de)
LED-LEITERRAHMENPAKET, LED-PAKET DAMIT UND VERFAHREN ZUR HERSTELLUNG DES LED-PAKETS
Title (fr)
BOÎTIER DEL POUR GRILLE DE CONNEXION, GRILLE DE CONNEXION UTILISANT LE BOÎTIER DEL, ET PROCÉDÉ DE FABRICATION DU BOÎTIER DEL
Publication
Application
Priority
- KR 2010001134 W 20100224
- US 38140809 A 20090310
- US 38140909 A 20090310
Abstract (en)
[origin: WO2010104276A2] A LED lead frame package, a LED package using the LED lead frame package, and a method of manufacturing the LED package. In the manufacture of the LED package, a liquid transparent resin material is disposed over at least two ring-shaped protrusions having a sharp upper edge and inclined sidewalls and at least one ring-shaped groove formed between two of the at least two ring-shaped protrusions, and thus a sealing layer having a convex curvature may be easily formed by using surface tension in one process.
IPC 8 full level
H01L 33/62 (2010.01); H01L 33/64 (2010.01)
CPC (source: EP)
H01L 33/486 (2013.01); H01L 33/507 (2013.01); H01L 33/54 (2013.01); H01L 33/642 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2933/005 (2013.01)
Citation (search report)
- [XYI] US 2008012036 A1 20080117 - LOH BAN P [US], et al
- [X] WO 2006095949 A1 20060914 - SEOUL SEMICONDUCTOR CO LTD [KR], et al
- [Y] US 2008029775 A1 20080207 - LIU CHIA-CHI [TW], et al
- [YA] US 2006012298 A1 20060119 - LEE MING-SHUN [TW], et al
- [YA] WO 2008105527 A1 20080904 - NEC LIGHTING LTD [JP], et al
- [YA] EP 1840977 A1 20071003 - KYOCERA CORP [JP]
- [A] US 2005218421 A1 20051006 - ANDREWS PETER [US], et al
- See references of WO 2010104276A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
DOCDB simple family (publication)
WO 2010104276 A2 20100916; WO 2010104276 A3 20101125; AU 2010221920 A1 20110929; CN 102318091 A 20120111; EP 2406835 A2 20120118; EP 2406835 A4 20130918; JP 2012520565 A 20120906; KR 101111256 B1 20120222; KR 20100106297 A 20101001; RU 2011134604 A 20130420; RU 2488195 C2 20130720; SG 173518 A1 20110929; TW 201044646 A 20101216
DOCDB simple family (application)
KR 2010001134 W 20100224; AU 2010221920 A 20100224; CN 201080007796 A 20100224; EP 10750967 A 20100224; JP 2011553937 A 20100224; KR 20107005556 A 20100224; RU 2011134604 A 20100224; SG 2011055852 A 20100224; TW 99106287 A 20100304