EP 2407736 A1 20120118 - HEAT PUMP DEVICE
Title (en)
HEAT PUMP DEVICE
Title (de)
WÄRMEPUMPENVORRICHTUNG
Title (fr)
DISPOSITIF DE POMPE À CHALEUR
Publication
Application
Priority
- JP 2010053842 W 20100309
- JP 2009060177 A 20090312
Abstract (en)
A heat pump apparatus that is capable of suppressing an increase in the installation area therefor and volume thereof is provided. A heat pump apparatus (1) includes a compressor (5) that compresses refrigerant, a condenser (2) that liquefies the compressed refrigerant, and an evaporator (4) that evaporates the liquefied refrigerant, wherein the condenser (2) and the evaporator (4) are plate-type heat exchangers formed in rectangular cuboid shapes, and the condenser (2), which is a plate-type heat exchanger, and the evaporator (4), which is a plate-type heat exchanger, are disposed next each other.
IPC 8 full level
F25B 1/00 (2006.01); F25B 1/04 (2006.01); F25B 30/02 (2006.01); F25B 31/00 (2006.01); F25B 39/02 (2006.01); F25B 39/04 (2006.01); F25B 43/00 (2006.01); F25B 43/02 (2006.01)
CPC (source: EP US)
F25B 30/02 (2013.01 - EP US); F25B 43/006 (2013.01 - EP US); F25B 43/02 (2013.01 - EP US); F25B 1/053 (2013.01 - EP US); F25D 23/006 (2013.01 - EP US)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
DOCDB simple family (publication)
US 2011185765 A1 20110804; EP 2407736 A1 20120118; EP 2407736 A4 20120912; JP 2010210224 A 20100924; JP 5386201 B2 20140115; WO 2010104057 A1 20100916
DOCDB simple family (application)
US 201013063637 A 20100309; EP 10750810 A 20100309; JP 2009060177 A 20090312; JP 2010053842 W 20100309