Global Patent Index - EP 2411817 B1

EP 2411817 B1 20160504 - VERTICALLY INTEGRATED MEMS ACCELERATION TRANSDUCER

Title (en)

VERTICALLY INTEGRATED MEMS ACCELERATION TRANSDUCER

Title (de)

VERTIKAL INTEGRIERTER MEMS-BESCHLEUNIGUNGSAUFNEHMER

Title (fr)

TRANSDUCTEUR MEMS D'ACCÉLÉRATION INTÉGRÉ VERTICALEMENT

Publication

EP 2411817 B1 20160504 (EN)

Application

EP 10756542 A 20100226

Priority

  • US 2010025579 W 20100226
  • US 40992009 A 20090324

Abstract (en)

[origin: WO2010110989A2] A transducer (20) includes sensors (28, 30) that are bonded to form a vertically integrated configuration. The sensor (28) includes a proof mass (32) movably coupled to and spaced apart from a surface (34) of a substrate (36). The sensor (30) includes a proof mass (58) movably coupled to and spaced apart from a surface (60) of a substrate (56). The substrates (36, 56) are coupled with the surface (60) of substrate (56) facing the surface (34) of substrate (36). Thus, the proof mass (58) faces the proof mass (32). The sensors (28, 30) are fabricated separately and can be formed utilizing differing micromachining techniques. The sensors (28, 30) are subsequently coupled (90) utilizing a wafer bonding technique to form the transducer (20). Embodiments of the transducer (20) may include sensing along one, two, or three orthogonal axes and may be adapted to detect movement at different acceleration sensing ranges.

IPC 8 full level

G01P 15/125 (2006.01); B81B 7/00 (2006.01); B81B 7/02 (2006.01); G01P 15/08 (2006.01); G01P 15/097 (2006.01); G01P 15/18 (2006.01)

CPC (source: EP US)

B81B 7/0064 (2013.01 - EP); B81B 7/0074 (2013.01 - EP US); G01P 15/0802 (2013.01 - EP US); G01P 15/125 (2013.01 - EP US); G01P 15/18 (2013.01 - EP US); B81B 2201/0235 (2013.01 - EP US); G01P 2015/0814 (2013.01 - EP US); G01P 2015/082 (2013.01 - EP US); G01P 2015/0831 (2013.01 - EP US); G01P 2015/0837 (2013.01 - EP US); G01P 2015/0848 (2013.01 - EP US); G01P 2015/0851 (2013.01 - EP US); G01P 2015/0871 (2013.01 - EP US); G01P 2015/088 (2013.01 - EP US)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

DOCDB simple family (publication)

WO 2010110989 A2 20100930; WO 2010110989 A3 20110113; CN 102356324 A 20120215; CN 102356324 B 20141224; EP 2411817 A2 20120201; EP 2411817 A4 20140723; EP 2411817 B1 20160504; JP 2012521565 A 20120913; JP 5638598 B2 20141210; US 2010242600 A1 20100930; US 8186221 B2 20120529

DOCDB simple family (application)

US 2010025579 W 20100226; CN 201080012403 A 20100226; EP 10756542 A 20100226; JP 2012502067 A 20100226; US 40992009 A 20090324