Global Patent Index - EP 2413085 A4

EP 2413085 A4 20140910 - ALUMINUM FIN MATERIAL FOR HEAT EXCHANGER

Title (en)

ALUMINUM FIN MATERIAL FOR HEAT EXCHANGER

Title (de)

ALUMINIUMRIPPENMATERIAL FÜR EINEN WÄRMETAUSCHER

Title (fr)

MATÉRIAU D'AILETTE EN ALUMINIUM POUR ÉCHANGEUR DE CHALEUR

Publication

EP 2413085 A4 20140910 (EN)

Application

EP 10756128 A 20100324

Priority

  • JP 2010055109 W 20100324
  • JP 2009072455 A 20090324

Abstract (en)

[origin: EP2413085A1] An aluminum fin material (1) for a heat exchanger, which is characterized by including a base (2) including aluminum or an aluminum alloy, a primer treatment layer (3) formed on the surface of the base (2), and a corrosion-resistant resin coating film layer (4) formed on the surface of the primer treatment layer (3), in which the corrosion-resistant resin coating film layer (4) includes a first corrosion-resistant resin coating film layer (4a) formed on the surface of the primer treatment layer (3) and a second corrosion-resistant resin coating film layer (4b) formed on the surface of the first corrosion-resistant resin coating film layer (4a), at least one of the first corrosion-resistant resin coating film layer (4a) and the second corrosion-resistant resin coating film layer (4b) includes an ethylene-acryl copolymer resin and has a thickness of 1 µm or more, and the corrosion-resistant resin coating film layer (4 )has a total thickness of 1.1 to 10 µm inclusive.

IPC 8 full level

F28F 19/04 (2006.01); F28F 1/32 (2006.01)

CPC (source: EP)

B05D 7/54 (2013.01); C23C 28/00 (2013.01); F28F 19/04 (2013.01); F28F 21/084 (2013.01); B05D 2202/25 (2013.01); F28F 1/32 (2013.01); F28F 17/005 (2013.01); F28F 2245/02 (2013.01)

Citation (search report)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

DOCDB simple family (publication)

EP 2413085 A1 20120201; EP 2413085 A4 20140910; CN 102348954 A 20120208; JP 2010223514 A 20101007; WO 2010110332 A1 20100930

DOCDB simple family (application)

EP 10756128 A 20100324; CN 201080011273 A 20100324; JP 2009072455 A 20090324; JP 2010055109 W 20100324