Global Patent Index - EP 2414304 A1

EP 2414304 A1 20120208 - METAL/CERAMIC SUBSTRATE

Title (en)

METAL/CERAMIC SUBSTRATE

Title (de)

METALL-KERAMIK-SUBSTRAT

Title (fr)

SUBSTRAT MÉTAL-CÉRAMIQUE

Publication

EP 2414304 A1 20120208 (DE)

Application

EP 10719582 A 20100326

Priority

  • DE 2010000347 W 20100326
  • DE 102009015520 A 20090402

Abstract (en)

[origin: WO2010112000A1] The invention relates to a metal/ceramic substrate, comprising a multilayer, plate-shaped ceramic material and at least one metallization which is provided on a surface side of the ceramic material and joined to the ceramic material by direct bonding (DCB method) or reactive brazing, wherein the ceramic material comprises at least one inner layer or base layer made of a silicon nitride ceramic, and wherein the surface side of the ceramic material provided with the at least one metallization is formed on an intermediate layer which is applied onto the at least one base layer and made of an oxidic ceramic.

IPC 8 full level

B32B 18/00 (2006.01); C04B 37/02 (2006.01); C04B 41/52 (2006.01); C04B 41/90 (2006.01); H01L 23/373 (2006.01); H05K 1/03 (2006.01); H05K 3/38 (2006.01)

CPC (source: EP KR US)

B32B 18/00 (2013.01 - KR); C04B 37/02 (2013.01 - KR); C04B 37/021 (2013.01 - EP US); C04B 37/025 (2013.01 - EP US); C04B 37/026 (2013.01 - EP US); C04B 41/52 (2013.01 - KR); C04B 41/90 (2013.01 - KR); H01L 23/3735 (2013.01 - EP US); H05K 3/38 (2013.01 - EP US); C04B 2235/95 (2013.01 - EP US); C04B 2235/96 (2013.01 - EP US); C04B 2235/9607 (2013.01 - EP US); C04B 2237/062 (2013.01 - EP US); C04B 2237/068 (2013.01 - EP US); C04B 2237/12 (2013.01 - EP US); C04B 2237/122 (2013.01 - EP US); C04B 2237/124 (2013.01 - EP US); C04B 2237/125 (2013.01 - EP US); C04B 2237/368 (2013.01 - EP US); C04B 2237/407 (2013.01 - EP US); C04B 2237/704 (2013.01 - EP US); C04B 2237/706 (2013.01 - EP US); C04B 2237/708 (2013.01 - EP US); C04B 2237/72 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US); H05K 1/0306 (2013.01 - EP US); H05K 2201/0175 (2013.01 - EP US); H05K 2201/0355 (2013.01 - EP US); Y10T 428/12549 (2015.01 - EP US); Y10T 428/2495 (2015.01 - EP US); Y10T 428/26 (2015.01 - EP US); Y10T 428/265 (2015.01 - EP US); Y10T 428/266 (2015.01 - EP US)

Citation (search report)

See references of WO 2010112000A1

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

DOCDB simple family (publication)

DE 102009015520 A1 20101007; CN 102421725 A 20120418; EP 2414304 A1 20120208; JP 2012522709 A 20120927; JP 5641451 B2 20141217; KR 20120027205 A 20120321; US 2012045657 A1 20120223; WO 2010112000 A1 20101007

DOCDB simple family (application)

DE 102009015520 A 20090402; CN 201080019205 A 20100326; DE 2010000347 W 20100326; EP 10719582 A 20100326; JP 2012502447 A 20100326; KR 20117026151 A 20100326; US 201013258852 A 20100326