EP 2415076 A2 20120208 - PRESSURE SUPPORT FOR AN ELECTRONIC CIRCUIT
Title (en)
PRESSURE SUPPORT FOR AN ELECTRONIC CIRCUIT
Title (de)
DRUCKUNTERSTÜTZUNG FÜR EINE ELEKTRONISCHE SCHALTUNG
Title (fr)
SUPPORT DE PRESSION POUR CIRCUIT ÉLECTRONIQUE
Publication
Application
Priority
- EP 2010054147 W 20100330
- DE 102009015757 A 20090401
Abstract (en)
[origin: WO2010112478A2] The invention relates to a circuit design comprising an electrical circuit, which comprises at least one electronic component attached to a substrate and a flat conductor track for electrically contacting the component, wherein on the electrical circuit an elastic element is provided and furthermore a device for applying a force to the elastic element is present so that the elastic element is pressed onto the electrical circuit. The crack formation in a solder under the component is thereby prevented.
IPC 8 full level
H01L 23/48 (2006.01)
CPC (source: EP KR US)
H01L 23/32 (2013.01 - KR); H01L 23/36 (2013.01 - KR); H01L 23/48 (2013.01 - KR); H01L 24/24 (2013.01 - EP US); H01L 24/25 (2013.01 - EP US); H01L 24/72 (2013.01 - EP US); H01L 24/82 (2013.01 - EP US); H01L 25/072 (2013.01 - EP US); H01L 24/29 (2013.01 - EP US); H01L 2224/24011 (2013.01 - EP US); H01L 2224/2402 (2013.01 - EP US); H01L 2224/24051 (2013.01 - EP US); H01L 2224/24225 (2013.01 - EP US); H01L 2224/24226 (2013.01 - EP US); H01L 2224/291 (2013.01 - EP US); H01L 2224/29191 (2013.01 - EP US); H01L 2224/32225 (2013.01 - EP US); H01L 2224/45147 (2013.01 - US); H01L 2224/73267 (2013.01 - EP US); H01L 2224/82039 (2013.01 - EP US); H01L 2924/00011 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/01005 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/0102 (2013.01 - EP US); H01L 2924/01023 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01068 (2013.01 - EP US); H01L 2924/01074 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/014 (2013.01 - EP US); H01L 2924/13055 (2013.01 - EP US); H01L 2924/15787 (2013.01 - EP US)
Citation (search report)
See references of WO 2010112478A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
DOCDB simple family (publication)
WO 2010112478 A2 20101007; WO 2010112478 A3 20110811; CN 102365734 A 20120229; CN 102365734 B 20150819; DE 102009015757 A1 20101014; EP 2415076 A2 20120208; JP 2012523109 A 20120927; KR 20120002982 A 20120109; RU 2011144091 A 20130510; US 2012075826 A1 20120329
DOCDB simple family (application)
EP 2010054147 W 20100330; CN 201080015502 A 20100330; DE 102009015757 A 20090401; EP 10713602 A 20100330; JP 2012502627 A 20100330; KR 20117022978 A 20100330; RU 2011144091 A 20100330; US 201013262582 A 20100330