EP 2415332 A2 20120208 - CONDUCTOR STRUCTURAL ELEMENT AND METHOD FOR PRODUCING A CONDUCTOR STRUCTURAL ELEMENT
Title (en)
CONDUCTOR STRUCTURAL ELEMENT AND METHOD FOR PRODUCING A CONDUCTOR STRUCTURAL ELEMENT
Title (de)
LEITERSTRUKTURELEMENT UND VERFAHREN ZUM HERSTELLEN EINES LEITERSTRUKTURELEMENTS
Title (fr)
ÉLÉMENT À STRUCTURE CONDUCTRICE ET PROCÉDÉ DE FABRICATION DUDIT ÉLÉMENT
Publication
Application
Priority
- EP 2010007736 W 20101217
- DE 102009060480 A 20091218
Abstract (en)
[origin: WO2011079918A2] The present invention relates to a method for producing a conductor structural element, comprising the following steps: providing a rigid substrate (12), electrodepositing a copper coating (14) on the rigid substrate (12), applying a conductor pattern structure (16) to the copper coating (14), then possibly mounting components, laminating the substrate with at least one electrically insulating layer (24, 28), detaching the rigid substrate (12), at least partially removing the remaining copper coating (14) of the rigid substrate (12) in such a way that the conductor pattern structure (16, 14, 42) is exposed.
IPC 8 full level
H05K 1/18 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H05K 3/20 (2006.01); H05K 3/42 (2006.01); H05K 3/46 (2006.01)
CPC (source: EP US)
H01L 21/4846 (2013.01 - EP US); H01L 21/486 (2013.01 - EP US); H01L 21/568 (2013.01 - EP US); H01L 21/6835 (2013.01 - EP US); H01L 23/3107 (2013.01 - EP US); H01L 24/19 (2013.01 - EP US); H01L 24/20 (2013.01 - EP US); H05K 1/186 (2013.01 - EP US); H01L 23/5389 (2013.01 - EP US); H01L 24/11 (2013.01 - EP US); H01L 24/13 (2013.01 - EP US); H01L 2221/68304 (2013.01 - US); H01L 2221/68327 (2013.01 - EP US); H01L 2221/6835 (2013.01 - EP US); H01L 2221/68363 (2013.01 - EP US); H01L 2221/68381 (2013.01 - EP US); H01L 2224/04105 (2013.01 - EP); H01L 2224/1134 (2013.01 - EP US); H01L 2224/12105 (2013.01 - EP US); H01L 2224/131 (2013.01 - EP); H01L 2224/13144 (2013.01 - EP US); H01L 2224/16225 (2013.01 - EP US); H01L 2224/2101 (2013.01 - EP US); H01L 2224/211 (2013.01 - EP US); H01L 2224/214 (2013.01 - EP US); H01L 2224/2201 (2013.01 - EP US); H01L 2224/221 (2013.01 - EP US); H01L 2224/224 (2013.01 - EP US); H01L 2224/32225 (2013.01 - EP US); H01L 2224/73204 (2013.01 - EP US); H01L 2224/73259 (2013.01 - EP US); H01L 2224/9202 (2013.01 - EP US); H01L 2924/00011 (2013.01 - EP US); H01L 2924/01004 (2013.01 - EP US); H01L 2924/01005 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01013 (2013.01 - EP US); H01L 2924/0102 (2013.01 - EP US); H01L 2924/01024 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/0103 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01044 (2013.01 - EP US); H01L 2924/01047 (2013.01 - EP US); H01L 2924/01061 (2013.01 - EP US); H01L 2924/01068 (2013.01 - EP US); H01L 2924/01078 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/01087 (2013.01 - EP US); H01L 2924/014 (2013.01 - EP US); H01L 2924/10253 (2013.01 - EP US); H01L 2924/12042 (2013.01 - EP US); H05K 1/189 (2013.01 - EP US); H05K 3/205 (2013.01 - EP US); H05K 3/429 (2013.01 - EP US); H05K 3/4602 (2013.01 - EP US); H05K 3/462 (2013.01 - EP US); H05K 2201/0355 (2013.01 - EP US); H05K 2201/0367 (2013.01 - EP US); H05K 2201/10977 (2013.01 - EP US); H05K 2203/063 (2013.01 - EP US); H05K 2203/1469 (2013.01 - EP US)
Citation (search report)
See references of WO 2011079918A2
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
WO 2011079918 A2 20110707; WO 2011079918 A3 20111013; CN 102763494 A 20121031; CN 102763494 B 20151125; DE 102009060480 A1 20110622; DE 202010017809 U1 20121115; EP 2415332 A2 20120208; EP 2415332 B1 20140730; EP 2814306 A1 20141217; JP 2013514637 A 20130425; JP 2016048795 A 20160407; US 2012320549 A1 20121220; US 9456500 B2 20160927
DOCDB simple family (application)
EP 2010007736 W 20101217; CN 201080064300 A 20101217; DE 102009060480 A 20091218; DE 202010017809 U 20101217; EP 10803568 A 20101217; EP 14002625 A 20101217; JP 2012543532 A 20101217; JP 2015223125 A 20151113; US 201013515012 A 20101217