EP 2415883 A1 20120208 - METHOD FOR PRODUCING HIGH-STRENGTH SEAMLESS CR-NI ALLOY PIPE
Title (en)
METHOD FOR PRODUCING HIGH-STRENGTH SEAMLESS CR-NI ALLOY PIPE
Title (de)
VERFAHREN ZUR HERSTELLUNG EINES HOCHFESTEN NAHTLOSEN ROHRS AUS EINER CR-NI-LEGIERUNG
Title (fr)
PROCÉDÉ DE FABRICATION D'UNE CONDUITE EN ALLIAGE DE CR-NI SANS SOUDURE À RÉSISTANCE ÉLEVÉE
Publication
Application
Priority
- JP 2010055520 W 20100329
- JP 2009088737 A 20090401
Abstract (en)
A method for producing a high-strength Cr-Ni alloy seamless pipe, excellent in hot workability and stress corrosion cracking resistance, without causing the lamination during piercing-rolling, comprising: preparing an alloy billet that has a chemical composition comprising, by mass%, of C: 0.05% or less, Si: 1.0% or less, Mn: less than 3.0%, P: 0.005% or less, S: 0.005% or less, Cu: 0.01 to 4.0%, Ni: 25% or more and less than 35%, Cr: 20 to 30%, Mo: 0.01% or more and less than 4.0%, N: 0.10 to 0.30%, Al: 0.03 to 0.30%, O (oxygen): 0.01% or less, REM (rare earth metal): 0.01 to 0.20%, and the balance being Fe and impurities, and satisfying the following formula (1); hot working to make a seamless material pipe on the basis of a cross roll piercing process; subjecting a solution treatment; and cold working. N × P / REM ‰¤ 0.10 wherein P, N and REM in formula (1) represent the contents (mass%) of P, N and REM, respectively. The Cr-Ni alloy may further contain one or more of W, Ti, Nb, Zr, V, Ca and Mg.
IPC 8 full level
C21D 8/10 (2006.01); C22C 38/00 (2006.01); C22C 38/58 (2006.01)
CPC (source: EP US)
C21D 6/004 (2013.01 - EP US); C21D 8/10 (2013.01 - EP US); C22C 1/11 (2023.01 - EP US)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
DOCDB simple family (publication)
EP 2415883 A1 20120208; EP 2415883 A4 20170607; EP 2415883 B1 20181226; CN 102369300 A 20120307; CN 102369300 B 20130724; ES 2714371 T3 20190528; JP 4553073 B1 20100929; JP WO2010113843 A1 20121011; US 2012031534 A1 20120209; WO 2010113843 A1 20101007
DOCDB simple family (application)
EP 10758614 A 20100329; CN 201080014375 A 20100329; ES 10758614 T 20100329; JP 2010055520 W 20100329; JP 2010512446 A 20100329; US 201113245110 A 20110926