EP 2420114 A1 20120222 - METHOD FOR CONDUCTIVELY CONNECTING A COMPONENT ON A TRANSPARENT SUBSTRATE
Title (en)
METHOD FOR CONDUCTIVELY CONNECTING A COMPONENT ON A TRANSPARENT SUBSTRATE
Title (de)
VERFAHREN ZUR LEITENDEN VERBINDUNG EINES BAUELEMENTES AUF EINEM TRANSPARENTEN SUBSTRAT
Title (fr)
PROCÉDÉ DESTINÉ À RELIER DE MANIÈRE CONDUCTRICE UN COMPOSANT SUR UN SUBSTRAT TRANSPARENT
Publication
Application
Priority
- EP 2010001961 W 20100327
- DE 102009017659 A 20090416
Abstract (en)
[origin: WO2010118821A1] The invention relates to a method for conductively connecting an electrical component having at least one conductive layer. The conductive layer is applied to a substrate which is essentially transparent in the visible wavelength zone of light, comprising the following steps: the electrical component or the conductive layer is provided with a lead material in the area where the component is to be connected to the conductive layer; the lead material is provided with energy supplied by an energy source such that the lead material melts, and a non-detachable, material-bonded, conductive connection between the electrical component and the conductive layer is formed.
IPC 8 full level
H05K 3/34 (2006.01); B23K 1/005 (2006.01)
CPC (source: EP KR US)
B23K 1/0016 (2013.01 - EP US); B23K 1/005 (2013.01 - EP KR US); B23K 26/361 (2015.10 - EP US); B23K 26/364 (2015.10 - EP US); B23K 26/40 (2013.01 - EP US); B23K 35/268 (2013.01 - EP US); B23K 35/3602 (2013.01 - EP US); H01L 24/81 (2013.01 - EP US); H05K 3/34 (2013.01 - KR); H05K 3/3494 (2013.01 - EP US); B23K 2101/42 (2018.07 - EP US); B23K 2103/172 (2018.07 - EP US); B23K 2103/18 (2018.07 - EP US); B23K 2103/50 (2018.07 - EP US); B23K 2103/52 (2018.07 - EP US); B23K 2103/54 (2018.07 - EP US); H01L 2224/81192 (2013.01 - EP US); H01L 2224/81224 (2013.01 - EP US); H01L 2224/97 (2013.01 - EP US); H01L 2924/12041 (2013.01 - EP US); H01L 2924/12042 (2013.01 - EP US); H01L 2924/15788 (2013.01 - EP US); H05K 1/0306 (2013.01 - EP US); H05K 3/341 (2013.01 - EP US); H05K 2201/0108 (2013.01 - EP US); H05K 2201/0112 (2013.01 - EP US); H05K 2201/0326 (2013.01 - EP US); H05K 2201/10106 (2013.01 - EP US); H05K 2203/107 (2013.01 - EP US); Y10T 29/49142 (2015.01 - EP US); Y10T 29/49144 (2015.01 - EP US); Y10T 29/49149 (2015.01 - EP US)
Citation (search report)
See references of WO 2010118821A1
Citation (examination)
ATHWAL I S ET AL: "Optical transmission of fluorine-doped tin oxide films", SOLID STATE ELECTRONICS, ELSEVIER SCIENCE PUBLISHERS, BARKING, GB, vol. 28, no. 11, 1 November 1985 (1985-11-01), pages 1165, XP025754850, ISSN: 0038-1101, [retrieved on 19851101], DOI: 10.1016/0038-1101(85)90197-2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
DOCDB simple family (publication)
WO 2010118821 A1 20101021; BR PI1011386 A2 20160315; CA 2758752 A1 20101021; CN 102396298 A 20120328; DE 102009017659 A1 20101028; EP 2420114 A1 20120222; JP 2012524389 A 20121011; KR 20110137793 A 20111223; RU 2011146319 A 20130527; SG 175176 A1 20111128; US 2012266461 A1 20121025; US 8484837 B2 20130716; ZA 201106915 B 20120530
DOCDB simple family (application)
EP 2010001961 W 20100327; BR PI1011386 A 20100327; CA 2758752 A 20100327; CN 201080017178 A 20100327; DE 102009017659 A 20090416; EP 10718455 A 20100327; JP 2012505070 A 20100327; KR 20117023785 A 20100327; RU 2011146319 A 20100327; SG 2011074143 A 20100327; US 201113273154 A 20111013; ZA 201106915 A 20110922