EP 2428105 A1 20120314 - METHOD AND APPARATUS FOR IMPROVING POWER AND LOSS FOR INTERCONECT CONFIGURATIONS
Title (en)
METHOD AND APPARATUS FOR IMPROVING POWER AND LOSS FOR INTERCONECT CONFIGURATIONS
Title (de)
VERFAHREN UND VORRICHTUNG FÜR ERHÖHTE LEISTUNG UND GERINGEREN VERLUST IN VERNETZUNGSKONFIGURATIONEN
Title (fr)
PROCÉDÉ ET APPAREIL POUR AMÉLIORER LA PUISSANCE ET LA PERTE POUR DES CONFIGURATIONS D'INTERCONNEXION
Publication
Application
Priority
- US 2010000043 W 20100108
- US 21536909 P 20090504
Abstract (en)
[origin: WO2010129002A1] The present disclosure relates to embedding a power modification component such as a capacitance or a resistance inside of pads that are located to extend over and beyond the vias of the PCB so that a portion of the pad containing the embedded capacitance or resistance is located beyond where the vias or blinds are located. Each of the pads will include an opening that is located over a given one of the vias or blinds to permit that via to conduct through the opening. In this way the capacitance and the resistance will have a closer contact point the electrical component.
IPC 8 full level
CPC (source: EP KR)
H05K 1/023 (2013.01 - EP); H05K 1/18 (2013.01 - KR); H05K 1/185 (2013.01 - EP); H05K 3/30 (2013.01 - KR); H05K 1/0231 (2013.01 - EP); H05K 1/0234 (2013.01 - EP); H05K 1/112 (2013.01 - EP); H05K 3/4046 (2013.01 - EP); H05K 2201/096 (2013.01 - EP); H05K 2201/10636 (2013.01 - EP); Y02P 70/50 (2015.11 - EP)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
DOCDB simple family (publication)
WO 2010129002 A1 20101111; CN 102415224 A 20120411; EP 2428105 A1 20120314; EP 2428105 A4 20130529; JP 2012526380 A 20121025; KR 20120007521 A 20120120; SG 178121 A1 20120329
DOCDB simple family (application)
US 2010000043 W 20100108; CN 201080019789 A 20100108; EP 10772351 A 20100108; JP 2012509780 A 20100108; KR 20117025869 A 20100108; SG 2012005781 A 20100108