EP 2430664 A2 20120321 - METHOD AND DEVICE FOR TREATING A WAFER
Title (en)
METHOD AND DEVICE FOR TREATING A WAFER
Title (de)
VERFAHREN UND VORRICHTUNG ZUR BEHANDLUNG EINES WAFERS
Title (fr)
PROCÉDÉ ET DISPOSITIF DE TRAITEMENT D'UNE PLAQUETTE
Publication
Application
Priority
- EP 2010056555 W 20100512
- DE 102009022337 A 20090513
Abstract (en)
[origin: CA2761459A1] In a method for coating a wafer to produce solar cells, a metal such as nickel, copper, or silver is deposited on the wafer in a continuous process in a coating bath containing said metal. A wafer is inserted into the coating bath, and at a time at which a first area of the wafer already extends into the coating bath but a second area does not yet extend into the coating bath, a current surge is applied to the second area of the wafer to initiate the galvanic deposition of the metal on the first area of the wafer reaching into the coating bath for a subsequent further automatic coating, with the wafer completely inserted into the coating bath, also of the remaining area of the wafer without further current surge or current flow.
IPC 8 full level
H01L 31/0224 (2006.01)
CPC (source: EP KR US)
C25D 5/02 (2013.01 - KR); C25D 5/024 (2013.01 - EP US); C25D 7/123 (2013.01 - EP US); C25D 17/001 (2013.01 - EP US); C25D 17/005 (2013.01 - EP US); H01L 31/022425 (2013.01 - EP US); H01L 31/04 (2013.01 - KR); H01L 31/18 (2013.01 - EP KR US); Y02E 10/50 (2013.01 - EP US)
Citation (search report)
See references of WO 2010130786A2
Citation (examination)
JP 2007131940 A 20070531 - HITACHI CHEMICAL CO LTD
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
DOCDB simple family (publication)
DE 102009022337 A1 20101118; AU 2010247404 A1 20111117; CA 2761459 A1 20101118; CN 102439730 A 20120502; CN 102439730 B 20150715; EP 2430664 A2 20120321; IL 216309 A0 20120131; JP 2012526914 A 20121101; KR 20120018155 A 20120229; MX 2011011985 A 20120228; SG 175365 A1 20111128; TW 201108449 A 20110301; US 2012052611 A1 20120301; WO 2010130786 A2 20101118; WO 2010130786 A3 20110714
DOCDB simple family (application)
DE 102009022337 A 20090513; AU 2010247404 A 20100512; CA 2761459 A 20100512; CN 201080020789 A 20100512; EP 10720400 A 20100512; EP 2010056555 W 20100512; IL 21630911 A 20111110; JP 2012510292 A 20100512; KR 20117026951 A 20100512; MX 2011011985 A 20100512; SG 2011078755 A 20100512; TW 99115342 A 20100513; US 201113294569 A 20111111