Global Patent Index - EP 2430701 A1

EP 2430701 A1 20120321 - MINIATURE MICROWAVE COMPONENT FOR SURFACE-MOUNTING

Title (en)

MINIATURE MICROWAVE COMPONENT FOR SURFACE-MOUNTING

Title (de)

MINIATURMIKROWELLENKOMPONENTE FÜR OBERFLÄCHENMONTAGE

Title (fr)

COMPOSANT MINIATURE HYPERFREQUENCES POUR MONTAGE EN SURFACE

Publication

EP 2430701 A1 20120321 (FR)

Application

EP 10714320 A 20100422

Priority

  • EP 2010055359 W 20100422
  • FR 0902160 A 20090505

Abstract (en)

[origin: WO2010127949A1] The invention relates to a miniature microwave component, comprising: an MMIC microwave chip (100) encapsulated in an individual housing (222) for surface-mounting capable of operating at a frequency F0 much higher than 45 GHz; at least one contactless microwave access (124), by electromagnetic coupling, ensuring the transmission of coupling signals at a operating frequency F0. The component comprises a passive multilayer integrated circuit (220) having metallized layers and layers made of a dielectric material (140, 142, 144), a top surface (224), a metallized bottom surface (225), the metallized bottom surface comprising, on the side of the contactless microwave access (124), an opening (236) in the metallization through which electromagnetic waves can pass for coupling by the contactless microwave access and, between two layers of dielectric material, a metallized layer (146) having at least one electromagnetic coupling electric conductor (148) connected to the electronic components of the chip (100), said coupling electric conductor (148) being located next to the contactless microwave access (124) in order to ensure the transmission of microwave signals by electromagnetic coupling at the operating frequency F0. The invention can be used in automobile radars and high-bandwidth communications.

IPC 8 full level

H01P 5/02 (2006.01); H01L 23/00 (2006.01); H01P 5/107 (2006.01); H05K 1/18 (2006.01)

CPC (source: EP US)

H01L 23/047 (2013.01 - EP US); H01P 5/028 (2013.01 - EP US); H01P 5/107 (2013.01 - EP US); H05K 1/0243 (2013.01 - EP US); H01L 2224/04042 (2013.01 - EP US); H01L 2224/16225 (2013.01 - EP US); H01L 2224/32245 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48137 (2013.01 - EP US); H01L 2224/48247 (2013.01 - EP US); H01L 2224/49171 (2013.01 - EP US); H01L 2224/73265 (2013.01 - EP US); H01L 2924/00011 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/1423 (2013.01 - EP US); H05K 2201/037 (2013.01 - EP US); H05K 2201/09072 (2013.01 - EP US); H05K 2201/10727 (2013.01 - EP US)

Citation (search report)

See references of WO 2010127949A1

Citation (examination)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

DOCDB simple family (publication)

WO 2010127949 A1 20101111; CN 102782934 A 20121114; CN 102782934 B 20150520; EP 2430701 A1 20120321; FR 2945379 A1 20101112; FR 2945379 B1 20110722; JP 2012526434 A 20121025; JP 5707657 B2 20150430; US 2012248587 A1 20121004

DOCDB simple family (application)

EP 2010055359 W 20100422; CN 201080024568 A 20100422; EP 10714320 A 20100422; FR 0902160 A 20090505; JP 2012508979 A 20100422; US 201013319078 A 20100422