EP 2432920 A2 20120328 - METHOD AND DEVICE FOR THE CONTROLLED ELECTROLYTIC TREATMENT OF THIN LAYERS
Title (en)
METHOD AND DEVICE FOR THE CONTROLLED ELECTROLYTIC TREATMENT OF THIN LAYERS
Title (de)
VERFAHREN UND VORRICHTUNG ZUM GESTEUERTEN ELEKTROLYTISCHEN BEHANDELN VON DÜNNEN SCHICHTEN
Title (fr)
PROCÉDÉ ET DISPOSITIF PERMETTANT LE TRAITEMENT ÉLECTROLYTIQUE COMMANDÉ DE COUCHES MINCES
Publication
Application
Priority
- DE 2010000592 W 20100518
- DE 102009023769 A 20090522
Abstract (en)
[origin: WO2010133220A2] The invention relates to a method and a device for electroplating a material (1) comprising an electric contact in the outer edge thereof, especially for electroplating substrates, e.g. as a wafer in a cup plater. Conventional methods result in a radial layer thickness difference, with a maximum in the edge region, when the starting layers are thin and the material has a large diameter. In order to obtain an even electroplating result, at least two electrolytic partial cells are formed which are supplied with current by respective electroplating current sources (9') and (9'') that can be individually adjusted. The partial cathode (12') and the associated partial anode (7') are supplied in the region of the diametrically remote partial cathode (12''). Conversely, the partial cathode (12'') is supplied via the base layer of the partial cathode (12'). The required leveling of the layer thickness distribution is inter alia carried out by alternate different adjustments of the quantity of the electroplating current of the two partial cells and by the electrodes (7, 12) that rotate relative to each other.
IPC 8 full level
C25D 7/00 (2006.01); C25D 7/12 (2006.01); C25D 17/00 (2006.01); C25F 7/00 (2006.01)
CPC (source: EP US)
C25D 7/123 (2013.01 - EP US); C25D 17/001 (2013.01 - EP US); C25D 17/002 (2013.01 - EP US); C25D 17/005 (2013.01 - EP US)
Citation (search report)
See references of WO 2010133220A2
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
DOCDB simple family (publication)
DE 102009023769 A1 20101125; CN 102459716 A 20120516; EP 2432920 A2 20120328; JP 2012527524 A 20121108; US 2012061244 A1 20120315; WO 2010133220 A2 20101125; WO 2010133220 A3 20110414
DOCDB simple family (application)
DE 102009023769 A 20090522; CN 201080022429 A 20100518; DE 2010000592 W 20100518; EP 10732269 A 20100518; JP 2012511145 A 20100518; US 201013320981 A 20100518