EP 2441129 B1 20161123 - PRESS-IN CONTACT FOR CONNECTING AN ELECTRONIC COMPONENT TO A PRINTED CIRCUIT BOARD AND PRESS-IN TOOL FOR PRODUCING A PRESS-IN CONTACT
Title (en)
PRESS-IN CONTACT FOR CONNECTING AN ELECTRONIC COMPONENT TO A PRINTED CIRCUIT BOARD AND PRESS-IN TOOL FOR PRODUCING A PRESS-IN CONTACT
Title (de)
EINPRESSKONTAKT ZUR VERBINDUNG EINES ELEKTRONISCHEN BAUELEMENTES MIT EINER LEITERPLATTE SOWIE EINPRESSWERKZEUG UND VERFAHREN ZUR HERSTELLUNG EINES EINPRESSKONTAKTES
Title (fr)
CONTACT À INSÉRER POUR RELIER UN COMPOSANT ÉLECTRONIQUE À UNE CARTE DE CIRCUITS IMPRIMÉS AINSI QU'OUTIL D'INSERTION ET PROCÉDÉ POUR FABRIQUER UN CONTACT À INSÉRER
Publication
Application
Priority
- DE 2010075048 W 20100609
- DE 102009025113 A 20090611
Abstract (en)
[origin: WO2010142289A2] The invention relates to a press-in contact and to a press-in tool for connecting an electronic component to a printed circuit board, the press-in contact of the electronic component being pressed into a contact opening of the printed circuit board by means of the press-in tool. The invention also relates to a method for producing a press-in contact. The press-in contact according to the invention comprises at least one guide region which can be received in a guide contour of the press-in tool in a position-fixing manner. The maximum length of the guide region is a multiple of the maximum width or is substantially equal to or only slightly shorter than the maximum width and/or the guide region is highly rigid in the press-in direction (z direction) and flexible in the other directions (x/y directions). The method according to the invention is characterized in that contiguous (interlinked) contours of the press-in contacts, which contours are produced as a tape, are supplied to a division station and are subdivided into individual press-in contacts in predetermined points of separation.
IPC 8 full level
H01R 12/00 (2006.01); H01R 12/58 (2011.01); H01R 13/631 (2006.01); H01R 43/16 (2006.01); H01R 43/20 (2006.01)
CPC (source: EP KR US)
H01R 12/585 (2013.01 - EP KR US); H01R 13/5816 (2013.01 - KR); H01R 13/6315 (2013.01 - EP KR US); H01R 43/16 (2013.01 - EP KR US); H01R 43/205 (2013.01 - EP KR US); Y10T 29/49204 (2015.01 - EP US); Y10T 29/53174 (2015.01 - EP US)
Citation (examination)
US 6083060 A 20000704 - CHEN HSIANG-PING [TW], et al
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR
DOCDB simple family (publication)
WO 2010142289 A2 20101216; WO 2010142289 A3 20110414; WO 2010142289 A4 20120223; CN 102576951 A 20120711; CN 102576951 B 20150610; DE 102009025113 A1 20101216; EP 2441129 A2 20120418; EP 2441129 B1 20161123; JP 2012529731 A 20121122; JP 5625052 B2 20141112; KR 101686571 B1 20161214; KR 20120052933 A 20120524; US 2012115339 A1 20120510; US 8579638 B2 20131112
DOCDB simple family (application)
DE 2010075048 W 20100609; CN 201080025974 A 20100609; DE 102009025113 A 20090611; EP 10781406 A 20100609; JP 2012514347 A 20100609; KR 20127000864 A 20100609; US 201013377504 A 20100609