EP 2442367 A3 20130522 - Improved method for forming metal contacts
Title (en)
Improved method for forming metal contacts
Title (de)
Verbessertes Verfahren zur Herstellung von Metallkontakten
Title (fr)
Procédé amélioré pour former des contacts métalliques
Publication
Application
Priority
US 39329510 P 20101014
Abstract (en)
[origin: EP2442367A2] Methods of forming metal contacts with metal inks in the manufacture of photovoltaic devices are disclosed. The metal inks are selectively deposited on semiconductor coatings by inkjet and aerosol apparatus. The composite is heated to selective temperatures where the metal inks burn through the coating to form an electrical contact with the semiconductor. Metal layers are then deposited on the electrical contacts by light induced or light assisted plating.
IPC 8 full level
H01L 31/0224 (2006.01); H01L 31/18 (2006.01)
CPC (source: EP KR US)
C09D 11/322 (2013.01 - EP US); C09D 11/52 (2013.01 - EP US); H01L 21/28 (2013.01 - KR); H01L 31/0224 (2013.01 - KR); H01L 31/022425 (2013.01 - EP US); H01L 31/042 (2013.01 - KR); H01L 31/18 (2013.01 - KR); Y02E 10/50 (2013.01 - EP US)
Citation (search report)
- [X] WO 2009059302 A1 20090507 - ALLIANCE SUSTAINABLE ENERGY [US], et al
- [A] US 2010124619 A1 20100520 - XU BAOMIN [US], et al
- [A] US 2009239331 A1 20090924 - XU BAOMIN [US], et al
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 2442367 A2 20120418; EP 2442367 A3 20130522; EP 2442367 B1 20140716; CN 103117327 A 20130522; CN 103117327 B 20160622; JP 2012094859 A 20120517; KR 101854142 B1 20180503; KR 20150127749 A 20151118; SG 180108 A1 20120530; US 2012129332 A1 20120524; US 8536049 B2 20130917
DOCDB simple family (application)
EP 11185113 A 20111013; CN 201110403012 A 20111014; JP 2011225620 A 20111013; KR 20110105446 A 20111014; SG 2011075348 A 20111014; US 201113273588 A 20111014